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Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous integration. Different assembly processes are used to optimize the yield of advanced packages, while the development of innovative advanced packaging materials is needed to address the many challenges faced in the assembly process for System...
A number of research articles have been published over the past several years showing the advantages glass-based solutions can bring to packaging and systems integration including radio frequency (RF) front-end devices, interposers, MEMs devices, and integrated photonics. In particular, RF applications for glass are gaining interest for use as a...
Qorvo Begins SHIP RF Packaging Program IFTLE has previously discussed the US State-of-the-art Heterogeneous Packaging and Prototyping (SHIPS) program (see IFTLE 422 “Is Advanced Packaging and Production returning to the US by SHIP?”) Qorvo was among the phase one winners in the SHIP program along with Intel, Xilinx, Northrop Grumman,...
A big 3D InCites congratulations to Professor Mitsumasa Koyanagi of Tohoku University’s New Industry Creation Hatchery Center (NICHe) and Dr. Peter Ramm, head of Strategic Projects at Fraunhofer EMFT, who have been named co-recipients of the 2020 IEEE Electronics Packaging Award for “pioneering contributions leading to the commercialization of 3D...
Why is attending Design Automation Conference (DAC 2020) important for 3D InCites readers? Two of my previous employers – National Semiconductor and VLSI Technology – could not keep up with market requirements. Lack of competitive electronic design automation (EDA) tools limited their engineers’ productivity and eventually both of these –...
Ira Feldman welcomed about 100 attendees to MEPTEC’s December luncheon at SEMI Headquarters to hear Jan Vardaman, Founder and President of TechSearch International deliver her annual “State of the IC Packaging Industry” address titled, “Market Drivers for Advanced Packaging: 2020 and Beyond.” In her opening statement, Vardaman emphasized that our...
The performance and productivity of microelectronics have increased continuously over the last 50 years due to the enormous advances in lithography and device technology. Today, these technologies are becoming prevalent in 3D packaging, which further enables advances in integrating various technologies (logic, memory, RF, sensors, etc.) in a small form...
As scientists, we have a tendency to classify and categorize. It’s our way of comparing and contrasting things in our world. Some of these classifications stick and some don’t. For instance at the start of 3D a decade or so ago, Eric Beyne of IMEC laid out a perfectly reasonable...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it is demonstrating optimized pre-processing solutions for the implementation of plasma dicing for advanced semiconductor packaging applications. EVG’s latest products and process development services support this emerging semiconductor back-end...
If you have an ear out for the new in the world of 3D IC technology as I do, then you might have caught one of the more interesting, and one of the freshest, voices in the field among the panelists speaking at the recent MEPTEC Semiconductor Roadmap Symposium in Santa...
