3D Packaging Pioneers Share 2020 IEEE Electronics Packaging Award
A big 3D InCites congratulations to Professor Mitsumasa Koyanagi of Tohoku University’s New Industry Creation Hatchery Center (NICHe) and Dr. Peter Ramm, head of Strategic Projects at Fraunhofer EMFT, who have been named co-recipients of the 2020 IEEE Electronics Packaging Award for “pioneering contributions leading to the commercialization of 3D...