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Bridging the gap: innovations in chiplet interconnect technology Chiplet interconnects begin with small chips – or chiplets – with a well-defined function that can be incorporated with other chiplets into a single package or system Dense interconnections between chiplets ensure fast, high-bandwidth electrical connections. This article discusses both interposer and...
This interview with Trymax Semiconductor’s Peter Dijkstra, Chief Commercial Officer (CCO), and Karsten Arts, Process Engineer first appeared in Atomic Limits as part of a series of posts about companies within the atomic scale processing industry. The goal of the series was to provide information about the kind of products...
Preparation for the 73rd ECTC started one year ago and was strongly supported by over 250 experts from 15 countries, members of 10 technical committees. The technical committees critically reviewed 618 submitted abstracts from industry (56.1%) and academia (43.9%), resulting in 369 technical papers. The papers, organized in 41 sessions,...
Let’s continue our look at papers presented during October’s IPC Advanced Packaging Symposium: “Building the IC-Substrate and Package Assembly Ecosystem”. NIST and the US CHIPS Act As we all know by now, the CHIPS and Science Act is being managed by NIST under the Dept of Commerce. NIST has always...
Continuing our look at key Hybrid Bonding (HB) papers at the recent ECTC 2022 in San Diego, CA. Applied Materials Hybrid bonding requires a lot of front-end processing tools, thus you can expect Applied Materials (AMAT) to be an entrant in this technology. In its paper “A Holistic Development Platform...
As the semiconductor packaging technology evolves in the “More than Moore” era, many advanced processes have presented challenges in manufacturing. Often, challenges in precision die bonding, for example, have led to trade-offs in yield, throughput, and ultimately manufacturing cost. Precision alignment has become one of the key capabilities for several...
A little over a year ago, I wrote a Knowledge Portal entry about the cost of 3D ICs. Here I am again to tackle the issue of 2.5D and 3D cost reduction from a slightly different angle. This entry is based on what SavanSys presented at IMAPS Device Packaging 2016....
For me, SEMICON West involves a careful balance of attending sessions, keynotes and panels, combined with one-on-one interviews with thought leaders in 3D ICs, as well as manufacturing suppliers who have the onerous task of developing, promoting, and selling the next great solution for 2.5D and 3D IC manufacturing. Over...
Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SEMICON WEST, San Francisco, July 9, 2013— EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved...
Enabling Commercialization of Groundbreaking Temporary Bonding and Debonding Technology ROLLA, MO, USA and st. florian, AUSTRIA, October 20, 2011 – Brewer Science, Inc., a global leading innovator and manufacturer of specialty materials, process solutions, and equipment for the microelectronics industry, and EV Group (EVG), a leading supplier of wafer bonding...
