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The week of July 10th IMAPS held its now annual reshoring conference jointly with the IPC. The General Chair of the meeting was Darren Crum, Office of the Undersecretary of Defense for Research and Engineering – Advanced Packaging Lead and the Technical Chair was Brandon Hamilton, Program Manager for Microelectronics...
Readers of IFTLE are aware that we have been spending significant time during the past two years describing the US government’s attempt to reshore advanced microelectronic packaging and detailing the onshoring programs they have created. If one message has come through loud and clear from our readers it is that...
TEMPE, Ariz.–Jun. 13, 2023– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services and the #1 automotive OSAT, is innovating advanced packaging to enable the car of the future. The evolution of the enhanced automotive experience has been dramatic over the past few years—a rise...
Years ago, when I was just a young pup in the industry, my manager asked me to attend a meeting in San Jose, California in 1997, where I participated in helping to define one of the early road maps for semiconductor technology, The early version I participated in was sponsored...
The WeKoPa Resort near Phoenix was the venue for the latest IC packaging focused conference, IMAPS DPC 2017, which took place in early March. The exhibition floor and all the sessions I joined were well attended and covered a broad range of topics, including design tools and methodology demonstrations from...
As it has in year’s past, the 2016 European 3D Summit kicked off with a market briefing. We heard from the usual suspects: Yole Dévéloppement (Rozalia Beica) and TechSearch International Inc. (Linda Bal). Additionally, in a nod to the business-centric tone of the conference, the committee invited Christian Knochenhauer, McKinsey...
I just boarded my flight home after attending the 2014 European 3D TSV Summit. Three days, 332 attendees from 21 countries, 24 presentations, 3 keynote speakers, 2 panel discussions, several face-to-face interviews and lots of side conversation all about 3D TSVS being Application Ready leads to a good deal of...
Semiconductor test and advanced packaging service provider, STATS ChipPAC Ltd. announced its next-generation three dimensional (3D) embedded Wafer Level Ball Grid Array (eWLB) Package-on-Package (PoP) solutions. This innovative new 3D technology provides an ultra thin package profile height below 1.0mm, a 30% height reduction over the industry standard 1.4mm total...
Rudolph Technologies, Inc. announced it has received multiple orders for its NSX® and WaferScanner™ Inspection Systems from STATS ChipPAC Ltd. The systems will be used for high-throughput inspection during each step of the eWLB (embedded wafer-level ball grid array) process. Shipments commenced in 4Q09 and will continue through 1Q10.
Here’s the great thing about establishing a community like 3D InCites: you’ve suddenly got the people who care the most about the topic literally at your fingertips. That’s one of the reasons SEMI came to me for advice on setting up the 3D IC and advanced packaging programs at SEMICON...
