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As summer holidays came to a close, September found our member companies ramping up new products and opening new facilities. The industry event season kicked off with SEMICON Taiwan and SEMICON India, IEEE 3DIC, MEMS & Imaging Sensors Summit, and more, and our members actively participated. Many of them were...
Customers and collaborators will have early access to next-generation glass substrate tools and software solutions to accelerate panel-level packaging R&D Onto Innovation Inc. today announced the opening of the company’s Packaging Applications Center of Excellence (PACE), a first-of-its-kind facility in the U.S. dedicated to panel-level packaging (PLP) innovations enabling 2.5D...
2020 proved to us that our world is wholly unpredictable. As the year began with optimism for a new decade and excitement for what the new decade might bring, the last thing expected was the arrival of COVID-19. Within a short time, the pandemic created unprecedented disruption while shattering lives...
In 1994 TSMC, a small wafer foundry from Taiwan held its first Technology Symposium. Since 1999 I have had the privilege to work with TSMC and closely follow their success in building a powerful and cost-effective ecosystem for the fabless IC vendors and foundry business model. To measure their success...
It’s been a busy few weeks for me as I attended both the International Wafer Level Packaging Conference (IWLPC), October 24-26, 2017 at the DoubleTree in San Jose and SEMI-MSIG’s MEMS and Sensors Executive Congress, October 31-Nov. 2, at the Hayes Mansion in San Jose. In addition to taking in...
The WeKoPa Resort near Phoenix was the venue for the latest IC packaging focused conference, IMAPS DPC 2017, which took place in early March. The exhibition floor and all the sessions I joined were well attended and covered a broad range of topics, including design tools and methodology demonstrations from...
On March 15, 2017, TSMC held its 23rd Symposium, based on popular request, at the Santa Clara Convention Center. I had the opportunity to attend the entire symposium and want to share some of my impressions and facts learned with you. TSMC, by far the biggest pure-play foundry, has pioneered...
As it has in year’s past, the 2016 European 3D Summit kicked off with a market briefing. We heard from the usual suspects: Yole Dévéloppement (Rozalia Beica) and TechSearch International Inc. (Linda Bal). Additionally, in a nod to the business-centric tone of the conference, the committee invited Christian Knochenhauer, McKinsey...
For me, SEMICON West involves a careful balance of attending sessions, keynotes and panels, combined with one-on-one interviews with thought leaders in 3D ICs, as well as manufacturing suppliers who have the onerous task of developing, promoting, and selling the next great solution for 2.5D and 3D IC manufacturing. Over...
Here’s the great thing about establishing a community like 3D InCites: you’ve suddenly got the people who care the most about the topic literally at your fingertips. That’s one of the reasons SEMI came to me for advice on setting up the 3D IC and advanced packaging programs at SEMICON...
