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Continuing our look at key Hybrid Bonding (HB) papers at the recent ECTC 2022 in San Diego, CA. Applied Materials Hybrid bonding requires a lot of front-end processing tools, thus you can expect Applied Materials (AMAT) to be an entrant in this technology. In its paper “A Holistic Development Platform...
Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous integration. Different assembly processes are used to optimize the yield of advanced packages, while the development of innovative advanced packaging materials is needed to address the many challenges faced in the assembly process for System...
Qorvo Begins SHIP RF Packaging Program IFTLE has previously discussed the US State-of-the-art Heterogeneous Packaging and Prototyping (SHIPS) program (see IFTLE 422 “Is Advanced Packaging and Production returning to the US by SHIP?”) Qorvo was among the phase one winners in the SHIP program along with Intel, Xilinx, Northrop Grumman,...
Why is attending Design Automation Conference (DAC 2020) important for 3D InCites readers? Two of my previous employers – National Semiconductor and VLSI Technology – could not keep up with market requirements. Lack of competitive electronic design automation (EDA) tools limited their engineers’ productivity and eventually both of these –...
Ira Feldman welcomed about 100 attendees to MEPTEC’s December luncheon at SEMI Headquarters to hear Jan Vardaman, Founder and President of TechSearch International deliver her annual “State of the IC Packaging Industry” address titled, “Market Drivers for Advanced Packaging: 2020 and Beyond.” In her opening statement, Vardaman emphasized that our...
The performance and productivity of microelectronics have increased continuously over the last 50 years due to the enormous advances in lithography and device technology. Today, these technologies are becoming prevalent in 3D packaging, which further enables advances in integrating various technologies (logic, memory, RF, sensors, etc.) in a small form...
As scientists, we have a tendency to classify and categorize. It’s our way of comparing and contrasting things in our world. Some of these classifications stick and some don’t. For instance at the start of 3D a decade or so ago, Eric Beyne of IMEC laid out a perfectly reasonable...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it is demonstrating optimized pre-processing solutions for the implementation of plasma dicing for advanced semiconductor packaging applications. EVG’s latest products and process development services support this emerging semiconductor back-end...
Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SEMICON WEST, San Francisco, July 9, 2013— EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved...
Enabling Commercialization of Groundbreaking Temporary Bonding and Debonding Technology ROLLA, MO, USA and st. florian, AUSTRIA, October 20, 2011 – Brewer Science, Inc., a global leading innovator and manufacturer of specialty materials, process solutions, and equipment for the microelectronics industry, and EV Group (EVG), a leading supplier of wafer bonding...
