Matches for your search: "fan-out wafer level packaging "
LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, announced that it has signed a formal agreement with Arizona State University (ASU) to further its partnership which began in 2024, focused on advanced IC-substrates, fan out wafer level packaging (FOWLP) and glass core metallization, as enabled...
As global semiconductor demand continues to surge, international collaboration has become essential for driving technological innovation. The US-JOINT consortium represents a key initiative in fostering cross-border cooperation between Japan and the United States. This groundbreaking collaboration brings together 10 companies- Azimuth Industrial Co. Inc., KLA Corp., Kulicke & Soffa Industries...
Wolfspeed & Hemlock Semiconductor Get Their CHIPS Act Share Arizona Facility to Focus on High Performance Computing In IFTLE 577 we reported that Amkor had announced plans to build an advanced packaging and test facility in Peoria, Arizona. In IFTLE 603 we reported that Amkor Technology had signed a preliminary...
The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration in Europe. The conference takes place every two years and is the IEEE EPS flagship conference in Europe, organized by IEEE EPS Region 8 (EMEA) Chapter in association with IMAPS...
SUNNYVALE, Calif., June 1st, 2022 –Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE:ASX, TAIEX: 3711), today introduced VIPack™, an advanced packaging platform designed to enable vertically integrated package solutions. VIPack™ represents ASE’s next generation of 3D heterogeneous integration architecture that extends design rules and...
Continuing our look at the 2021 IMAPS International Symposium, let’s take a deeper look at the integrated photonics keynote presentation by Tyndall Institute. Integrated Photonics at Tyndall Institute Peter O’Brien discussed “Packaging Technologies for Integrated Photonics”. Tyndall Institute is part of Univ College Cork Ireland. They offer prototyping platforms and...
More on TSMC’s SoIC Hybrid Bonding Technology Nikkei Asia announced that TSMC is working with Google and AMD to develop its SoIC hybrid bonding packaging technology. Google plans to use the SoIC chips for autonomous driving systems and other applications. AMD is reportedly eager to take advantage of chip stacking...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has successfully demonstrated a complete process flow for collective die-to-wafer (D2W) hybrid and fusion bonding with sub-two-micron placement accuracy utilizing existing EVG wafer bonding technology and processes,...
Garching, September 17, 2015 – SUSS MicroTec, a global supplier of equipment and applications for the semiconductor industry and related markets, has launched the new bonding platform XB8 today. The XB8 wafer bonder is designed for a wide range of bonding processes. It supports substrates with a wafer size of...
The Packaging and Test Group of the Fab Owners Association, (Cupertino, CA) held its first official meeting on February 4th. This was just one of the meetings held as part of the third annual FOA Collaborative Forum in Santa Clara, CA. The fourteen inaugural FOA packaging and test group (FOA-PT) members heard...
