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As global semiconductor demand continues to surge, international collaboration has become essential for driving technological innovation. The US-JOINT consortium represents a key initiative in fostering cross-border cooperation between Japan and the United States. This groundbreaking collaboration brings together 10 companies- Azimuth Industrial Co. Inc., KLA Corp., Kulicke & Soffa Industries...
The week of July 10th IMAPS held its now annual reshoring conference jointly with the IPC. The General Chair of the meeting was Darren Crum, Office of the Undersecretary of Defense for Research and Engineering – Advanced Packaging Lead and the Technical Chair was Brandon Hamilton, Program Manager for Microelectronics...
Readers of IFTLE are aware that we have been spending significant time during the past two years describing the US government’s attempt to reshore advanced microelectronic packaging and detailing the onshoring programs they have created. If one message has come through loud and clear from our readers it is that...
TEMPE, Ariz.–Jun. 13, 2023– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services and the #1 automotive OSAT, is innovating advanced packaging to enable the car of the future. The evolution of the enhanced automotive experience has been dramatic over the past few years—a rise...
Years ago, when I was just a young pup in the industry, my manager asked me to attend a meeting in San Jose, California in 1997, where I participated in helping to define one of the early road maps for semiconductor technology, The early version I participated in was sponsored...
More on TSMC’s SoIC Hybrid Bonding Technology Nikkei Asia announced that TSMC is working with Google and AMD to develop its SoIC hybrid bonding packaging technology. Google plans to use the SoIC chips for autonomous driving systems and other applications. AMD is reportedly eager to take advantage of chip stacking...
The Packaging and Test Group of the Fab Owners Association, (Cupertino, CA) held its first official meeting on February 4th. This was just one of the meetings held as part of the third annual FOA Collaborative Forum in Santa Clara, CA. The fourteen inaugural FOA packaging and test group (FOA-PT) members heard...
I just boarded my flight home after attending the 2014 European 3D TSV Summit. Three days, 332 attendees from 21 countries, 24 presentations, 3 keynote speakers, 2 panel discussions, several face-to-face interviews and lots of side conversation all about 3D TSVS being Application Ready leads to a good deal of...
Semiconductor test and advanced packaging service provider, STATS ChipPAC Ltd. announced its next-generation three dimensional (3D) embedded Wafer Level Ball Grid Array (eWLB) Package-on-Package (PoP) solutions. This innovative new 3D technology provides an ultra thin package profile height below 1.0mm, a 30% height reduction over the industry standard 1.4mm total...
Rudolph Technologies, Inc. announced it has received multiple orders for its NSX® and WaferScanner™ Inspection Systems from STATS ChipPAC Ltd. The systems will be used for high-throughput inspection during each step of the eWLB (embedded wafer-level ball grid array) process. Shipments commenced in 4Q09 and will continue through 1Q10.
