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If you’re new to the advanced packaging industry, it may have crossed your mind to invest in a professional development course. IMAPS, or the International Microelectronics Assembly and Packaging Society, offers exactly that. Their packaging-specific, IMAPS Academy courses are aimed at promoting a stronger understanding of key parts of the...
ERS electronic GmbH, the innovation leader in thermal management solutions for the semiconductor manufacturing industry, is taking the first ever step towards developing the new generation of thermal debonding and warpage adjustment tools for fan-out panel level packaging (FOPLP). The new ERS MPDM700 supports the increasing demand for fast prototyping...
It’s almost ironic. As CMOS scaling (aka: Moore’s Law) has slowed due to the increased complexity and cost of achieving smaller nodes, the focus has shifted to advanced packaging and heterogeneous integration to meet demands for microelectronics devices targeting the internet of things (IoT) market. These devices perform a variety...
Let’s start with the indoor rainstorm. I arrived at the Swan and Dolphin in Orlando just in time for the fan-out plenary session of ECTC 2017, so tossed my stuff in my room and headed on in (wearing jeans, no less!) You can read about that here. Afterward, I had...
The fan-out conversation that started at IMAPS DPC 2017 in March continued this week at the annual Electronics Components Technology Conference (ECTC), which took place in Orlando at the Walt Disney World Swan and Dolphin Resort. The buzz started during the Tuesday evening plenary session, where panelists Douglas Yu, TSMC,...
2016 was a turning point for fan-out (FO) packaging. With Apple’s entrance and its subsequent decision to package its A10 APE in TSMC’s fan-out solution, the market changed. Thus advanced packaging leaders decided large investments for the development of fan-out platforms, impacting the related equipment and materials market. “Indeed, both...
Flanders, New Jersey —Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed an order for the JetStep® Lithography System for the semiconductor advanced packaging industry’s first panel fan-out manufacturing line. The JetStep S Series Lithography System was selected after a thorough evaluation...
For many years now, the semiconductor industry development has been governed by Moore’s law and the increasing demand for higher performance and lower manufacturing costs. Under this context, the “More than Moore” company, Yole Développement (Yole) has identified a strong interest for panel-level packaging technologies. “At Yole, we saw a...
No SEMICON West would be complete without a few laps around Moscone North and South, and some one-on-one chats with suppliers. I stopped in to see several semiconductor supplier companies who annually request an audience with the Queen of 3D to talk about their latest accomplishments, as well as gain...
I thought I would go to Singapore, attend EPTC (Electronic Packaging Technology Conference 2013) and then take off on my personal vacation to India to attend my 40th high school reunion and 35th college reunion – two weeks tops. It escalated quickly. It ended up being 34 day, 20 city,...
