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In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb in our January Industry Forecast to declare, as our cover story: Advanced Packaging Saves the World! In 2008, we tempered that declaration to Advanced Packaging Drives the Industry! By 2009,...
One of the ways I learn about advanced packaging technology and what it entails is by visiting our community member companies. There’s nothing like talking to the experts face-to-face and walking through a cleanroom or advanced packaging applications lab to drive home a concept. For the past year, I’ve been...
TSMC 2nm Chips Coming in 2025 At its recent North America Technology Symposium TSMC announced that it will begin volume production of 2nm chips by 2025. TSMC’s roadmap is similar to that of its major competitors—Samsung and Intel—which also have reported also have plans to manufacture 2nm chips around 2025....
This week we’re looking at some packaging presentations from the 2021 IMAPS Device Packaging Workshop. The focus is on Nepes mPoP and Sumotomo Bakelite EMC. Nepes – Fan Out mPoP BC Kim described Nepes M-series fan-out package mPoP. mPoP is a stackable package-on-package structure used to provide an integrated solution...
TEMPE, Arizona – Oct. 20, 2020 – Deca, an industry-leading provider of advanced electronic interconnect technologies, announced today the signing of an agreement with ADTEC Engineering to join its new AP Live Network. The partnership allows ADTEC to embed an AP Connect module into its new 2µm Laser Direct Imaging...
We hit the exhibits at IWLPC 2019 with a vengeance this year. Our mission was twofold – to find out the latest supplier offerings to support technology trends, and to spread the word about our new community membership opportunities on 3D InCites. But I’ll get to that part in a...
The International Electronic Device Manufacturing Conference (IEDM) has always focused on device scaling, successfully guiding our industry for several decades along the challenging paths of Moore’s Law and the ITRS Roadmap. Both were primarily focused on digital functions. However, we all must agree that the real world around us is analog....
Editor’s note: For several years now, Mentor Graphics has evangelized about the critical need for assembly design kits to enable commercialization of high-density advanced packaging technologies, such as fine line and space fan-out, 2.5D and 3D IC packages. With this week’s introduction of a unique, end-to-end, high-density advanced packaging (HDAP) design...
Within the photolithography equipment market reaching US$ 150M 2014 (Source: Photolithography Equipment & Materials for Advanced Packaging, MEMS and LED Applications report, June 2015), advanced packaging applications have the strongest growth. Yole Développement (Yole) estimates that more than 40 systems have been installed in 2014, with a compound annual growth...
Our industry is seeing greater diversification in manufacturing processes than it has since its earliest days. In the front-end numerous new materials, architectures, and processes are under development to enable the continuing march toward smaller device sizes. In the back-end, and many places in between, advanced packaging processes and 3D...
