Matches for your search: "fan-out wafer level packaging "
Wafer-level packaging (WLP) saw significant growth in 2021 due in large part to the increased performance needs of data-driven 5G network devices. Because WLP is performed when chips are still on the wafer, ACM Research has been able to leverage and adapt our expertise in front-end solutions to address high-volume...
Back from our IFTLE #500 trip down memory lane, let’s continue our look at the SEMI Heterogeneous Integration Summit. We’ll focus on the semiconductor supply chain, the advanced packaging market, and advancements in image sensor technology. Semiconductor Supply Chain Research at BCG Martin Schrems, senior advisor at Boston Consulting Group,...
3D InCites presented the 2019 process of the year award to Eric Beyne and Arnita Podpod of IMEC for their flip-chip on fan-out wafer-level package (FC on FOWLP) process that avoids the use of TSVs in active chips to achieve high-density packaging. Advanced packaging practitioners may have noticed the similarities...
IIFTLE is always on the lookout for technologies that will require advanced packaging solutions. Fingerprint sensors for today’s latest smartphones appear to be one of those applications. Packaging for Fingerprint Sensors DIGITIMes recently reported that the manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require extensive...
While the shopping malls and specialty stores in and around San Francisco were packed with people hunting for Holiday presents, a very dedicated crowd of 3D IC developers and users from all over the world got together near San Francisco, for the 12th 3D ASIP conference, which featured, once again,...
There is no rest for the weary. Just because we can finally declare that 3D ICs are in production doesn’t mean we’re done working on it. To the contrary, efforts are ongoing at research institutes like imec in Belgium and Leti in France to take 3D integration to the next...
Our industry is seeing greater diversification in manufacturing processes than it has since its earliest days. In the front-end numerous new materials, architectures, and processes are under development to enable the continuing march toward smaller device sizes. In the back-end, and many places in between, advanced packaging processes and 3D...
I just boarded my flight home after attending the 2014 European 3D TSV Summit. Three days, 332 attendees from 21 countries, 24 presentations, 3 keynote speakers, 2 panel discussions, several face-to-face interviews and lots of side conversation all about 3D TSVS being Application Ready leads to a good deal of...
STATS ChipPAC Ltd, and outsourced semiconductor assembly and test (OSAT) provider, announced it is expanding its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities. STATS ChipPAC was one of the first OSATS to invest in TSV technology with a 51,000 square foot research and development...
It’s a good story that’s been 30 years in the making. From its founding by Erich and Aya Maria Thallner in 1980 and subsequent launch of the world’s first double-sided mask aligner for the emerging MEMS market five years later; to its most recent industry-first launch of a fully-automated wafer...
