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KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging

Oct 15, 2024

Today KLA Corporation introduced the industry’s widest breadth of process control and process-enabling solutions for IC substrate (ICS) manufacturing. KLA’s combined expertise in front-end semiconductors, packaging and IC substrates will help customers achieve breakthroughs in packaging interconnect density for chips targeting high-performance applications. KLA Corporation now offers the industry’s widest...

SEMICON West 2022: 3D InCites Member Company Preview

Jun 30, 2022

Sustainability, smart technologies, and workforce development will take center stage at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco. More than 200 industry leaders, visionaries and technology experts will be on hand to network and showcase the industry’s newest technologies and products while sharing insights...

Increasing the Conductive Density of Power Packaging

Mar 03, 2021

March 3, 2021 – Wide bandgap (WBG) semiconductor technologies have created new challenges and opportunities for power packages. Developments such as silicon carbide (SiC) and gallium nitride (GaN), have a higher figure of merit (FOM) compared to silicon MOSFETs and have extended the efficiency, output power and/or switching frequency range...

Using Calibre for Advanced IC Packaging Verification and Signoff

Mar 02, 2021

To satisfy industry demand for continued increases in electronic functions per unit area, foundries and out­sourced assembly and test (OSAT) companies have shifted their emphasis to driving advanced IC packaging innovation. One path is to integrate into the package, smaller, heteroge­neous or homogeneous, high-yield chips or chiplets: functional building blocks...

DBI® Ultra Changes the Game for Heterogeneous Integration

Jun 18, 2019

I’ve been following the DBI story for over a decade (well before Xperi became a sponsor of 3D InCites). I’ve watched it grow from its humble, start-up beginnings as a Ziptronix process to its current rock-star status at Xperi/Invensas, as THE current hybrid bonding technology process for image sensors globally....

Sir Walter Raleigh towered above the 50th IMAPS Symposium

Oct 19, 2017

Almost 500 years ago Walter Raleigh was born in England, rose rapidly in the favor of Queen Elizabeth I and was knighted in 1585. In 1587 he initiated the founding of Raleigh. Last week he welcomed – appropriately dressed – about one thousand semiconductor experts to the 50th International Symposium...

Rudolph Secures $17M in Orders for Inspection of Critical Advanced Packaging Applications

Apr 02, 2015

Flanders, New Jersey (April 1, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced that a major semiconductor foundry and a top outsourced semiconductor assembly and test (OSAT) facility have placed multi-million dollar orders totaling approximately $17M for several NSX® Series and Wafer Scanner™ inspection systems. Several systems were shipped in the first quarter...

KLA Tencor: CV310i Wafer Edge Inspection and Metrology Module

Jun 23, 2014

CIRCL CV310i module is an advanced Wafer Edge inspection, metrology and profiling system tailored for Advanced Wafer Level Packaging. Simultaneous wafer edge inspection and metrology enables comprehensive data collection from all zones comprising the wafer’s edge: top and bottom near-edge; top and bottom bevel; and apex. Testimonial Some of the...

Can cost-sharing accelerate 3D IC commercialization?

May 18, 2009

I’ve been talking a lot about the collaborative efforts in the form of open and closed consortia and joint development agreements that seem to be carrying 3D IC integration forward to market adoption. Another approach is a multi-project wafer program, in which participants cost-share to build multiple device prototypes...