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KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging

Oct 15, 2024

Today KLA Corporation introduced the industry’s widest breadth of process control and process-enabling solutions for IC substrate (ICS) manufacturing. KLA’s combined expertise in front-end semiconductors, packaging and IC substrates will help customers achieve breakthroughs in packaging interconnect density for chips targeting high-performance applications. KLA Corporation now offers the industry’s widest...

ECTC 2024: Advanced Packaging Engineers to the Rescue!

Jun 01, 2024

If you were one of the almost 2000 attendees at ECTC 2024, held May 28-31 2024, in Denver, Co, then you must be feeling very important right now; especially if you’re an advanced packaging engineer. Whether you’re improving energy efficiency, increasing yield, delivering innovative process control solutions, designing next-generation advanced...

IFTLE 588: CHIPS NAPMP Materials & Substrates Program

Mar 27, 2024

The Creating Helpful Innovations in the Production of Semiconductors (CHIPS) workforce initiatives are shown in Figure 1: The CHIPS vision for success for the National Advanced Packaging Manufacturing Program (NAPMP) is to establish U.S. leadership in advanced packaging and provide the technology needed for packaging manufacturing in the U.S. Ex-IBM...

Feature Photo: Arizona Governor Katie Hobbs speaks at the US Business Day forum in Taipei yesterday. Photo Credit: Carlos Garcia Rawlins, Reuters

IFTLE 574: Arizona Talks Packaging with TSMC

Oct 30, 2023

Also STEAMPIPE winners and are Japan’s semiconductor materials companies acquisition targets? Arizona talks packaging with TSMC Ever since TSMC announced it was putting an advanced chip fab in Arizona, IFTLE has been screaming to anyone who would listen that this did not make any sense if the chips had to...

SEMICON West 2022: 3D InCites Member Company Preview

Jun 30, 2022

Sustainability, smart technologies, and workforce development will take center stage at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco. More than 200 industry leaders, visionaries and technology experts will be on hand to network and showcase the industry’s newest technologies and products while sharing insights...

Increasing the Conductive Density of Power Packaging

Mar 03, 2021

March 3, 2021 – Wide bandgap (WBG) semiconductor technologies have created new challenges and opportunities for power packages. Developments such as silicon carbide (SiC) and gallium nitride (GaN), have a higher figure of merit (FOM) compared to silicon MOSFETs and have extended the efficiency, output power and/or switching frequency range...

Rudolph Secures $17M in Orders for Inspection of Critical Advanced Packaging Applications

Apr 02, 2015

Flanders, New Jersey (April 1, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced that a major semiconductor foundry and a top outsourced semiconductor assembly and test (OSAT) facility have placed multi-million dollar orders totaling approximately $17M for several NSX® Series and Wafer Scanner™ inspection systems. Several systems were shipped in the first quarter...

KLA Tencor: CV310i Wafer Edge Inspection and Metrology Module

Jun 23, 2014

CIRCL CV310i module is an advanced Wafer Edge inspection, metrology and profiling system tailored for Advanced Wafer Level Packaging. Simultaneous wafer edge inspection and metrology enables comprehensive data collection from all zones comprising the wafer’s edge: top and bottom near-edge; top and bottom bevel; and apex. Testimonial Some of the...

Can cost-sharing accelerate 3D IC commercialization?

May 18, 2009

I’ve been talking a lot about the collaborative efforts in the form of open and closed consortia and joint development agreements that seem to be carrying 3D IC integration forward to market adoption. Another approach is a multi-project wafer program, in which participants cost-share to build multiple device prototypes...