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If you were one of the almost 2000 attendees at ECTC 2024, held May 28-31 2024, in Denver, Co, then you must be feeling very important right now; especially if you’re an advanced packaging engineer. Whether you’re improving energy efficiency, increasing yield, delivering innovative process control solutions, designing next-generation advanced...
The Creating Helpful Innovations in the Production of Semiconductors (CHIPS) workforce initiatives are shown in Figure 1: The CHIPS vision for success for the National Advanced Packaging Manufacturing Program (NAPMP) is to establish U.S. leadership in advanced packaging and provide the technology needed for packaging manufacturing in the U.S. Ex-IBM...
Also STEAMPIPE winners and are Japan’s semiconductor materials companies acquisition targets? Arizona talks packaging with TSMC Ever since TSMC announced it was putting an advanced chip fab in Arizona, IFTLE has been screaming to anyone who would listen that this did not make any sense if the chips had to...
TSMC 2nm Chips Coming in 2025 At its recent North America Technology Symposium TSMC announced that it will begin volume production of 2nm chips by 2025. TSMC’s roadmap is similar to that of its major competitors—Samsung and Intel—which also have reported also have plans to manufacture 2nm chips around 2025....
Over $100 million in orders encompass solutions for 2.5D, 3D packaging and hybrid bonding applications WILMINGTON, Mass.–(BUSINESS WIRE)– Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced a total order backlog of $500 million comprised of more than $100 million for its lithography and inspection products...
March 3, 2021 – Wide bandgap (WBG) semiconductor technologies have created new challenges and opportunities for power packages. Developments such as silicon carbide (SiC) and gallium nitride (GaN), have a higher figure of merit (FOM) compared to silicon MOSFETs and have extended the efficiency, output power and/or switching frequency range...
We hit the exhibits at IWLPC 2019 with a vengeance this year. Our mission was twofold – to find out the latest supplier offerings to support technology trends, and to spread the word about our new community membership opportunities on 3D InCites. But I’ll get to that part in a...
The International Electronic Device Manufacturing Conference (IEDM) has always focused on device scaling, successfully guiding our industry for several decades along the challenging paths of Moore’s Law and the ITRS Roadmap. Both were primarily focused on digital functions. However, we all must agree that the real world around us is analog....
Editor’s note: For several years now, Mentor Graphics has evangelized about the critical need for assembly design kits to enable commercialization of high-density advanced packaging technologies, such as fine line and space fan-out, 2.5D and 3D IC packages. With this week’s introduction of a unique, end-to-end, high-density advanced packaging (HDAP) design...
Within the photolithography equipment market reaching US$ 150M 2014 (Source: Photolithography Equipment & Materials for Advanced Packaging, MEMS and LED Applications report, June 2015), advanced packaging applications have the strongest growth. Yole Développement (Yole) estimates that more than 40 systems have been installed in 2014, with a compound annual growth...
