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Let’s continue our look at the key presentations at IMAPS DPC 2022 from ASE, Amkor, Yole Développement and Adeia. ASE Lihong Cao discussed ASE’s “Enhanced Fanout Embedded Bridge Packaging Technology for Chiplet Integration” The packaging industry is looking for alternatives to silicon through silicon via (TSV) technologies. Embedded SI die...
The IPC is a non-profit global association for printed circuit board (PCB) manufacturers. Traditionally its focus has been on printed wiring boards, but more recently, as high-density PCB substrates have been used in packaging applications like BGAs, they have entered the realm of advanced packaging. Based on the announcements of...
50 years of providing specialized thermal solutions to the semiconductor industry is a significant accomplishment. It means your company is nearly as old as the industry itself and has successfully evolved right alongside it. So ERS electronic GmbH, located in Germering, Germany, was ready to celebrate in a big, big...
Sitaram Arkalgud, VP 3D technologies, Invensas, provided the entertainment at last week’s IWLPC 2015. As soon as he realized Phil Garrou wasn’t in attendance, he reverted to using the 2.5D terminology, despite the fact that on numerous occasions, I have voiced my disdain for the term, preferring “interposer integration.” Arkulgud...
From the perspective of 3D integration and its march towards commercialization, there was not much new being presented at the 2015 IMAPS Device Packaging Conference and the Global Business Council (IMAPS DPC 2015) held concurrently in Fountain Hills, AZ, (March 16-19); at least not since the European 3D TSV Summit 2015, or 3D...
Interposer designs and 3D ICs shift a significant part of the value creation to material vendors and assembly/test houses. It’s only logical that Françoise von Trapp, in her role as Queen of 3D, moderated a high-profile 3D panel this week at the International Wafer Level Packaging Conference (IWLPC), at the...
I can’t believe it’s already been a year since I last posted my annual guide to 3D at SEMICON West. One thing I’ve noticed in scanning the “regulars” (SEMI and SEMI partner events) is that all the agendas are much less focused on 3D integration developments. I think there are...
Unique Configurations Bring Improved Process Control, Lower CoO, and Higher Throughput to Pave the Way for Leading-Edge Technology Adoption Horsham, PA, (July 8, 2013) – Today at SEMICON West, Solid State Equipment LLC (DBA SSEC), a leading provider of single wafer wet processing systems used in the manufacture of semiconductor...
Every once in a while, it’s helpful to step back and get a broad view of what’s going on in the world of packaging as a whole to get a better idea of how much impact 3D has. In this morning’s opening keynote at the IMAPS Device Packaging Conference, Prismark...
Reader’s Choice Award Amkor: SLIM Francoise von TrappJune 22, 2015 Awards-Devices, Awards-Winner0 Amkor’s SLIM (siliconless integrated module) is a dies-last package technology providing the thinnest possible form factor with the highest level of integration by use of back-end-of-line technology combined with assembly-based fan-out architectures. It has optimal registration, 3D access to...
