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Let’s continue our look at the key presentations at IMAPS DPC 2022 from ASE, Amkor, Yole Développement and Adeia. ASE Lihong Cao discussed ASE’s “Enhanced Fanout Embedded Bridge Packaging Technology for Chiplet Integration” The packaging industry is looking for alternatives to silicon through silicon via (TSV) technologies. Embedded SI die...
This week we’re looking at some packaging presentations from the 2021 IMAPS Device Packaging Workshop. The focus is on Nepes mPoP and Sumotomo Bakelite EMC. Nepes – Fan Out mPoP BC Kim described Nepes M-series fan-out package mPoP. mPoP is a stackable package-on-package structure used to provide an integrated solution...
To satisfy industry demand for continued increases in electronic functions per unit area, foundries and outsourced assembly and test (OSAT) companies have shifted their emphasis to driving advanced IC packaging innovation. One path is to integrate into the package, smaller, heterogeneous or homogeneous, high-yield chips or chiplets: functional building blocks...
TEMPE, Arizona – Oct. 20, 2020 – Deca, an industry-leading provider of advanced electronic interconnect technologies, announced today the signing of an agreement with ADTEC Engineering to join its new AP Live Network. The partnership allows ADTEC to embed an AP Connect module into its new 2µm Laser Direct Imaging...
50 years of providing specialized thermal solutions to the semiconductor industry is a significant accomplishment. It means your company is nearly as old as the industry itself and has successfully evolved right alongside it. So ERS electronic GmbH, located in Germering, Germany, was ready to celebrate in a big, big...
I’ve been following the DBI story for over a decade (well before Xperi became a sponsor of 3D InCites). I’ve watched it grow from its humble, start-up beginnings as a Ziptronix process to its current rock-star status at Xperi/Invensas, as THE current hybrid bonding technology process for image sensors globally....
Almost 500 years ago Walter Raleigh was born in England, rose rapidly in the favor of Queen Elizabeth I and was knighted in 1585. In 1587 he initiated the founding of Raleigh. Last week he welcomed – appropriately dressed – about one thousand semiconductor experts to the 50th International Symposium...
Interposer designs and 3D ICs shift a significant part of the value creation to material vendors and assembly/test houses. It’s only logical that Françoise von Trapp, in her role as Queen of 3D, moderated a high-profile 3D panel this week at the International Wafer Level Packaging Conference (IWLPC), at the...
I can’t believe it’s already been a year since I last posted my annual guide to 3D at SEMICON West. One thing I’ve noticed in scanning the “regulars” (SEMI and SEMI partner events) is that all the agendas are much less focused on 3D integration developments. I think there are...
Unique Configurations Bring Improved Process Control, Lower CoO, and Higher Throughput to Pave the Way for Leading-Edge Technology Adoption Horsham, PA, (July 8, 2013) – Today at SEMICON West, Solid State Equipment LLC (DBA SSEC), a leading provider of single wafer wet processing systems used in the manufacture of semiconductor...
