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Also: hynix Advanced Packaging in Indiana; Fraunhofer Chiplet Center; Call to Unify Advanced Packaging Standards Is the U.S. Government Becoming Wary of Intel Investment? Toms Hardware, a great site for the latest info on microelectronic hardware, is noting that Intel is reportedly facing a delay in the release of its...
Siemens Digital Industries Software today announced that South Korea-based nepes corporation, a global leader in Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of advanced design flows from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with...
September 20, 2023 The Fraunhofer Institute for Reliability and Microintegration IZM is marking its thirtieth year with a high-profile international conference in September. The Institute that now employs more than 400 people at its three sites was founded by twenty-one German scientists on a mission. Its main site in the...
With over 350 papers in 36 oral sessions and 5 interactive presentations, there was no shortage of content to absorb at the 2023 Electronics Components Technology Conference (ECTC 2023), which took place May 31-June 2 in Orlando, FL. The keynote and panel sessions discussed technical topics including quantum computing, chip-to-wafer...
Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes...
This week we continue our look at the IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, held in Washington, DC in October. Being the IPC, we could — and should — expect a focus on high-density laminates (HDL) and high-density build-up substrates (HDBU); but they also brought...
As part of the 2022 IMAPS Device Packaging Conference, the IMAPS Global Business Council (GBC) devoted its 2022 session to the DoDs State-of-the-art (SOTA) Heterogeneous Integrated Packaging (SHIP) Program. The SHIP program is funded by the Office of the Under Secretary of Defense (OUSD). Crane Naval Center SHIP Program director...
Plasma Dicing Advanced packaging is bringing with it new ways to separate die from the wafer. In the past, wafer dicing was traditionally carried out using conventional dicing “saw”. However, this method has limitations such as die chipping or cracking leading to lower device yields. Also, the width of the...
That was my kick-off question for Manish Ranjan, Vice President, Product Marketing, Advanced Packaging/Nanotechnology Segment at Ultratech, during our annual SEMICON West Thursday wrap-up discussion. It’s never been planned that way, but I always seem to interview Ranjan at the tail-end of SEMICON West, and subsequently end up bouncing a...
ECTC sure knew how to pack ‘em in early this year! It was no accident that they held a special session on the Transforming Role of the Packaging Foundry on the Professional Development Course Day (Tuesday, May 29). Instead of 30 or so stragglers who wandered in between their regular...
