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Also: hynix Advanced Packaging in Indiana; Fraunhofer Chiplet Center; Call to Unify Advanced Packaging Standards Is the U.S. Government Becoming Wary of Intel Investment? Toms Hardware, a great site for the latest info on microelectronic hardware, is noting that Intel is reportedly facing a delay in the release of its...
September 20, 2023 The Fraunhofer Institute for Reliability and Microintegration IZM is marking its thirtieth year with a high-profile international conference in September. The Institute that now employs more than 400 people at its three sites was founded by twenty-one German scientists on a mission. Its main site in the...
This week we continue our look at the IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, held in Washington, DC in October. Being the IPC, we could — and should — expect a focus on high-density laminates (HDL) and high-density build-up substrates (HDBU); but they also brought...
As part of the 2022 IMAPS Device Packaging Conference, the IMAPS Global Business Council (GBC) devoted its 2022 session to the DoDs State-of-the-art (SOTA) Heterogeneous Integrated Packaging (SHIP) Program. The SHIP program is funded by the Office of the Under Secretary of Defense (OUSD). Crane Naval Center SHIP Program director...
The IPC is a non-profit global association for printed circuit board (PCB) manufacturers. Traditionally its focus has been on printed wiring boards, but more recently, as high-density PCB substrates have been used in packaging applications like BGAs, they have entered the realm of advanced packaging. Based on the announcements of...
Sitaram Arkalgud, VP 3D technologies, Invensas, provided the entertainment at last week’s IWLPC 2015. As soon as he realized Phil Garrou wasn’t in attendance, he reverted to using the 2.5D terminology, despite the fact that on numerous occasions, I have voiced my disdain for the term, preferring “interposer integration.” Arkulgud...
From the perspective of 3D integration and its march towards commercialization, there was not much new being presented at the 2015 IMAPS Device Packaging Conference and the Global Business Council (IMAPS DPC 2015) held concurrently in Fountain Hills, AZ, (March 16-19); at least not since the European 3D TSV Summit 2015, or 3D...
That was my kick-off question for Manish Ranjan, Vice President, Product Marketing, Advanced Packaging/Nanotechnology Segment at Ultratech, during our annual SEMICON West Thursday wrap-up discussion. It’s never been planned that way, but I always seem to interview Ranjan at the tail-end of SEMICON West, and subsequently end up bouncing a...
Every once in a while, it’s helpful to step back and get a broad view of what’s going on in the world of packaging as a whole to get a better idea of how much impact 3D has. In this morning’s opening keynote at the IMAPS Device Packaging Conference, Prismark...
Reader’s Choice Award Amkor: SLIM Francoise von TrappJune 22, 2015 Awards-Devices, Awards-Winner0 Amkor’s SLIM (siliconless integrated module) is a dies-last package technology providing the thinnest possible form factor with the highest level of integration by use of back-end-of-line technology combined with assembly-based fan-out architectures. It has optimal registration, 3D access to...
