Matches for your search: "fan-out wafer level packaging "
This week we continue our look at the IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, held in Washington, DC in October. Being the IPC, we could — and should — expect a focus on high-density laminates (HDL) and high-density build-up substrates (HDBU); but they also brought...
Let’s continue our look at the key presentations at IMAPS DPC 2022 from ASE, Amkor, Yole Développement and Adeia. ASE Lihong Cao discussed ASE’s “Enhanced Fanout Embedded Bridge Packaging Technology for Chiplet Integration” The packaging industry is looking for alternatives to silicon through silicon via (TSV) technologies. Embedded SI die...
ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, reveals the details of its third-generation flagship thermal debond machine, ADM330. The machine was introduced to the market in 2007 as the first-of-its-kind. Since then, it has become an industry-favourite and can be found on...
This week we’re looking at some packaging presentations from the 2021 IMAPS Device Packaging Workshop. The focus is on Nepes mPoP and Sumotomo Bakelite EMC. Nepes – Fan Out mPoP BC Kim described Nepes M-series fan-out package mPoP. mPoP is a stackable package-on-package structure used to provide an integrated solution...
TEMPE, Arizona – Oct. 20, 2020 – Deca, an industry-leading provider of advanced electronic interconnect technologies, announced today the signing of an agreement with ADTEC Engineering to join its new AP Live Network. The partnership allows ADTEC to embed an AP Connect module into its new 2µm Laser Direct Imaging...
50 years of providing specialized thermal solutions to the semiconductor industry is a significant accomplishment. It means your company is nearly as old as the industry itself and has successfully evolved right alongside it. So ERS electronic GmbH, located in Germering, Germany, was ready to celebrate in a big, big...
I can’t believe it’s already been a year since I last posted my annual guide to 3D at SEMICON West. One thing I’ve noticed in scanning the “regulars” (SEMI and SEMI partner events) is that all the agendas are much less focused on 3D integration developments. I think there are...
Unique Configurations Bring Improved Process Control, Lower CoO, and Higher Throughput to Pave the Way for Leading-Edge Technology Adoption Horsham, PA, (July 8, 2013) – Today at SEMICON West, Solid State Equipment LLC (DBA SSEC), a leading provider of single wafer wet processing systems used in the manufacture of semiconductor...
Every once in a while, it’s helpful to step back and get a broad view of what’s going on in the world of packaging as a whole to get a better idea of how much impact 3D has. In this morning’s opening keynote at the IMAPS Device Packaging Conference, Prismark...
Reader’s Choice Award Amkor: SLIM Francoise von TrappJune 22, 2015 Awards-Devices, Awards-Winner0 Amkor’s SLIM (siliconless integrated module) is a dies-last package technology providing the thinnest possible form factor with the highest level of integration by use of back-end-of-line technology combined with assembly-based fan-out architectures. It has optimal registration, 3D access to...
