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Siemens Digital Industries Software today announced that South Korea-based nepes corporation, a global leader in Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of advanced design flows from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with...
With over 350 papers in 36 oral sessions and 5 interactive presentations, there was no shortage of content to absorb at the 2023 Electronics Components Technology Conference (ECTC 2023), which took place May 31-June 2 in Orlando, FL. The keynote and panel sessions discussed technical topics including quantum computing, chip-to-wafer...
Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes...
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test (OSAT) services, is advancing the evolution of 5G RF module design, characterization and packaging technology. With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other...
See that title? That was only part of how I spent last Thursday (December 3). My morning started with the monthly Global SemiSister Social Hour, segued right into Yole’s Webinar about 3D packaging breakthroughs, then it was on to The GSA Awards (I have never been to the live awards...
I have finally been in this industry long enough to understand the cycle of discussion, scrutiny, call to arms, and discussions that emerging technologies go through on their way to adoption. What I first witnessed with the building of the 3D IC ecosystem, is now happening with chiplets. This past...
At the recent IMAPS Device Packaging Conference, Yole discussed how advanced packaging is leading electronics into the next decade. As you have heard from IFTLE for many years now, scaling is falling into the background as advanced packaging is taking the lead in determining the majority of new product innovations....
The first SEMI Standards Committee was formed in 1973 to address silicon wafer dimensional specifications. At the time, there was a proliferation of over 2000 different wafer specifications, leading to major inefficiencies at a time when the industry was just getting underway. Wafer suppliers banded together under SEMI to solve...
Plasma Dicing Advanced packaging is bringing with it new ways to separate die from the wafer. In the past, wafer dicing was traditionally carried out using conventional dicing “saw”. However, this method has limitations such as die chipping or cracking leading to lower device yields. Also, the width of the...
ECTC sure knew how to pack ‘em in early this year! It was no accident that they held a special session on the Transforming Role of the Packaging Foundry on the Professional Development Course Day (Tuesday, May 29). Instead of 30 or so stragglers who wandered in between their regular...
