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As the semiconductor packaging technology evolves in the “More than Moore” era, many advanced processes have presented challenges in manufacturing. Often, challenges in precision die bonding, for example, have led to trade-offs in yield, throughput, and ultimately manufacturing cost. Precision alignment has become one of the key capabilities for several...
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test (OSAT) services, is advancing the evolution of 5G RF module design, characterization and packaging technology. With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other...
See that title? That was only part of how I spent last Thursday (December 3). My morning started with the monthly Global SemiSister Social Hour, segued right into Yole’s Webinar about 3D packaging breakthroughs, then it was on to The GSA Awards (I have never been to the live awards...
I have finally been in this industry long enough to understand the cycle of discussion, scrutiny, call to arms, and discussions that emerging technologies go through on their way to adoption. What I first witnessed with the building of the 3D IC ecosystem, is now happening with chiplets. This past...
At the recent IMAPS Device Packaging Conference, Yole discussed how advanced packaging is leading electronics into the next decade. As you have heard from IFTLE for many years now, scaling is falling into the background as advanced packaging is taking the lead in determining the majority of new product innovations....
The first SEMI Standards Committee was formed in 1973 to address silicon wafer dimensional specifications. At the time, there was a proliferation of over 2000 different wafer specifications, leading to major inefficiencies at a time when the industry was just getting underway. Wafer suppliers banded together under SEMI to solve...
Heterogeneous integrated circuit (IC) packaging has made a full entrance into the high-performance computing arena. The target applications are broad, running the gamut from artificial intelligence (AI), deep learning, data center networking, supercomputers, and autonomous driving. In fact, a new generation of deep learning AI, leading central processing units (CPUs)...
Continuing our look at the 2019 SEMI 3D and Systems summit in Dresden, we look at presentations on advanced packaging platforms and hybrid bonding reliability. Additionally, TSMC reveals its revenue goals for 2019.
Sitaram Arkalgud, VP 3D technologies, Invensas, provided the entertainment at last week’s IWLPC 2015. As soon as he realized Phil Garrou wasn’t in attendance, he reverted to using the 2.5D terminology, despite the fact that on numerous occasions, I have voiced my disdain for the term, preferring “interposer integration.” Arkulgud...
I was invited to attend Amkor’s bi-annual customer symposium, which was held in Santa Clara two weeks ago. It was a grand event, complete with rock music intros narrated by a disembodied Voice of Authority for the execs (wait, was that AC/DC’s Back in Black I heard as CEO Steve...
