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July is always an exciting month for the semiconductor industry thanks to SEMICON West. July Member News reflects the significant progress our members made in sustainability, industry expansion, technology innovation, workforce development, and more. Achievements include but are not limited to advancements in emissions reduction targets and new technologies enhancing...
Wafer Thinning and Nano TSVs In the last few years, Ann Jourdain of IMEC and co-workers have described silicon device stacking through extreme silicon thinning technology. Recently Jourdan and Dave Thomas of SPTS reviewed this technology for the Jan/Feb issue of Chip Scale Review. The technology is interesting enough that...
“The die-attach equipment market is showing a 6% CAGR between 2018 and 2024”, announces Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea. “This industry will reach US$1.3 billion by 2024, fueled by the assembly and packaging opportunities created by semiconductor megatrends.” The latest semiconductor manufacturing report...
Is advanced packaging production coming back to the USA? The Navy (i.e. NSWC Crane) is currently seeking proposals from the industry for the development of technical and business plans to establish a secure on-shore design, assembly, and test capability. This facility should support the heterogeneous integration of state-of-the-art (SOTA) commercial...
The expected increase of the power device market, with a compound annual growth rate (CAGR) of more than 10% — and more particularly insulated-gate bipolar transistor (IGBT) products for automotive and other applications — is pushing the semiconductor industry to adopt specific process solutions. The maturity of IGBT market, boosted...
Wilmington, Mass. (12/11/2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced the receipt of over $12M in new orders for its recently-released NovusEdge™ system for edge and backside inspection on bare silicon wafers. The new orders are for capacity expansions at our existing customers as well as orders from two additional large wafer manufacturers...
Grenoble, France, May 9, 2017 – UnitySC, a leader in advanced inspection and metrology solutions, today announced multiple orders from a leading integrated device manufacturer (IDM) for its modular 4See Series automated defect inspection platform. The systems were selected because they deliver optimal wafer backside surface and edge defect inspection,...
Through silicon via (TSV) reveal is a critical part of the wafer-thinning step in 3D IC backside processing, where the wafer is thinned to expose the Cu “nails” that ultimately form the interconnect between die stacks. Some of the risks involved in this step include backside contamination (Cu diffusion) due...
49 years ago, Solid State Equipment, LLC (SSEC) opened its doors with its first piece of semiconductor equipment; a seam sealer for welding the lid on hermetic packages. Today, that tool still exists, and although it now accounts for 1% of SSEC’s revenue instead of 50%, sales have remained constant...
Company to share key developments and highlights at SEMICON West
