Search Results

Matches for your search: "fan-out wafer level packaging "

January Member News: Technology Innovation, Strategic partnerships, Expansion and More

Jan 30, 2025

January Member News celebrates major developments in semiconductor technology, strategic partnerships, industry expansions, and workforce growth. Companies introduced cutting-edge packaging, process control, and inspection solutions, while various acquisitions strengthened the U.S. semiconductor supply chain. There were various new hiring opportunities across the industry, upcoming conferences, and notable achievements. Innovation and...

Figure 4 – ESTC: Steffen Kröhnert, President & Founder of ESPAT-Consulting and 3D InCites Representative in Europe talked in the Special Session on EU Chips Act and IPCEI ME/CT about the future of Packaging in Europe

European Semiconductor Packaging Week

Oct 29, 2024

The European semiconductor packaging community, together with its international colleagues, supply chain partners, customers and guests met for a full week fully dedicated to Semiconductor Packaging, Assembly and Test from September 9-13, 2024, at Mercure Hotel MOA Berlin and with it depicted the largest Packaging event in Europe in 2024....

Leaning Into Interconnectology – Musings from IMAPS Symposium 2024

Oct 08, 2024

Call me crazy, but after spending three days at the 2024 International Microelectronics and Packaging Society (IMAPS) Symposium in Boston learning about the latest industry trends and technology advancements, I think it’s time for the entire advanced packaging world to fully adopt the concepts of “Interconnectology” and “Interconnectologist”. The inspiration...

IFTLE 539: IMAPS On-Shore Packaging & Assembly Workshop; TSMC 3DFabric Alliance

Nov 10, 2022

As we mentioned in IFTLE 537, IMAPS held the Onshoring: Packaging and Assembly Workshop prior to the traditional IMAPS fall symposium. Let’s take a look at what we learned from some of those key presentations. And then we’ll look at an important announcement by TSMC about its 3DFabric Alliance. Intel...

ESTC 2022 Member Company Preview

Aug 31, 2022

Chaired by 3D InCites Community member Steffen Kröhnert of ESPAT Consulting, the Electronics System-Integration Technology Conferences (ESTC) series is a premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications. This year, the event is being held in Sibiu,...

IFTLE 437: Packaging Trends for Artificial Intelligence

Jan 13, 2020

As it has in recent years, SEMICON Europa 2019 featured a dedicated Advanced Packaging Conference. In this and my next post, we will look at some of the key presentations. In Jan Vardaman’s TechSearch presentation “Packaging Trends for Artificial Intelligence (AI)” she noted that the following package types would be...

Trymax Receives Multi-System Orders from a Top Ten OSAT

May 17, 2019

NIJMEGEN, THE NETHERLANDS – May 15, 2019. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced it has received multi-system orders for its NEO 2000 and NEO 3000 series from a top ten OSAT based in Taiwan. This order will expand the existing NEO install base...

iPhone 7: Apple Charts a Strategic Course by Selecting TSMC’s inFO Platform

Oct 21, 2016

Each year, Apple integrates more and more innovative technologies in its iPhone products. This year, with the new iPhone 7 and its A10 processor, the leading company is the first organization to bring out package-on-package (PoP) wafer-level packaging (WLP) at the consumer scale. Apple underwent a strategic change by selecting...

Rudolph Technologies Unveils New Inspection Suite for Front- and Back-end Semiconductor Manufacturing

Sep 07, 2016

Rudolph continues to drive the technological innovation of its inspection and metrology products to deliver solutions that address the demanding needs across front- and back-end processes Wilmington, Mass. (September 6, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC) today launched two new inspection and metrology solutions for advanced semiconductor manufacturing: the Firefly™ System...

Success for 3D: What A Difference a Year Makes

Jan 31, 2016

During the 2015 European 3D TSV Summit, I drove attendees to distraction by asking each presenter what success looked like to them for 3D integration. The resulting responses became a blog post, What Does Success for 3D Integration Look Like? Now, a year later, I decided to revisit the topic by...