Matches for your search: "fan-out wafer level packaging "
Wafer Thinning and Nano TSVs In the last few years, Ann Jourdain of IMEC and co-workers have described silicon device stacking through extreme silicon thinning technology. Recently Jourdan and Dave Thomas of SPTS reviewed this technology for the Jan/Feb issue of Chip Scale Review. The technology is interesting enough that...
From the cloud to edge computing, the quest for ever-greater power efficiency remains researchers’ top priority. From high-end niche to mass-market applications, the best cost-to-performance tradeoff is key to providing a competitive advantage. While Moore’s Law has helped meet the performance required in terms of data transfer and power efficiency...
I first met Dr. Thomas Fries, Founder, and CEO of FRT, The Art of Metrology in 2016 at SEMI Europe’s 3D Summit in Grenoble. Fries became a big fan of 3D InCites, following us on social media, and sharing our content. Over the next few years, Fries and the team...
“The die-attach equipment market is showing a 6% CAGR between 2018 and 2024”, announces Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea. “This industry will reach US$1.3 billion by 2024, fueled by the assembly and packaging opportunities created by semiconductor megatrends.” The latest semiconductor manufacturing report...
Is advanced packaging production coming back to the USA? The Navy (i.e. NSWC Crane) is currently seeking proposals from the industry for the development of technical and business plans to establish a secure on-shore design, assembly, and test capability. This facility should support the heterogeneous integration of state-of-the-art (SOTA) commercial...
The expected increase of the power device market, with a compound annual growth rate (CAGR) of more than 10% — and more particularly insulated-gate bipolar transistor (IGBT) products for automotive and other applications — is pushing the semiconductor industry to adopt specific process solutions. The maturity of IGBT market, boosted...
Grenoble, France, May 9, 2017 – UnitySC, a leader in advanced inspection and metrology solutions, today announced multiple orders from a leading integrated device manufacturer (IDM) for its modular 4See Series automated defect inspection platform. The systems were selected because they deliver optimal wafer backside surface and edge defect inspection,...
“How is heterogeneous 3D integration defined?” There are certainly different understandings in the microelectronics community regarding the definition of heterogenous 3D integration. In a very general definition, it is defined as the 3D integration of different devices such as a CMOS processor and a memory, for example. A more limiting specification would...
One of 60 research institutes that make up Germany’s Fraunhofer Gesellschaft, the Fraunhofer Institute for Reliability and Microintegration IZM is known worldwide for its work in the realm of microelectronic packaging and system integration. The center ASSID (which stands for All Silicon System Integration Dresden) was established as a division...
Company to share key developments and highlights at SEMICON West
