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ECTC

2025 IEEE Electronic Components and Technology Conference Highlights Microelectronics Packaging and Component Breakthroughs

Feb 27, 2025

More than 2,000 scientists, engineers and businesspeople are expected to attend the 75th annual IEEE Electronic Components and Technology Conference (ECTC) from May 27-30, 2025 at the Gaylord Texan Resort & Convention Center here. ECTC is the premier international event bringing together the best in packaging, components, and microelectronic systems science, technology, and...

The Evolution of Interconnects in Microelectronics Packaging

Nov 11, 2024

Semiconductor packaging is a complex and evolving field, involving multiple disciplines. As a microelectronics packaging engineer, I focus on the “interconnect thread” from the chip to the system (Figure 1). To me, packaging is about interconnectivity (essentially). The primary function of packaging is to provide the interconnection from the IC...

CHIPCon 2023: Demystifying the Chiplet Ecosystem

Aug 02, 2023

IMAPS‘ inaugural CHIPCon 2023 – the reinvention of its Advanced SiP Conference – took place July 24-27 in San Jose. Right out of the gate, it reminded me of the early days of RTI’s 3D ASIP Conference that I attended for nine straight Decembers in Burlingame, CA. The single-track format...

ACM Research Adds Metal Lift Off Capability to Ultra C pr Tool to Support Power Semiconductor Manufacturing and Wafer Level Packaging Applications

Nov 11, 2022

First system qualified at power semiconductor manufacturer in China FREMONT, Calif., Nov. 11, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that it has expanded its Ultra C pr product offering to include...

ClassOne Technology Announces New Surface Preparation Technologies that Extend the Solstice® Single-Wafer Platform

Jul 26, 2022

Longtime customer and leading VCSEL provider TRUMPF cites the value of Solstice’s key SP capabilities, performance, and footprint ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has expanded its flagship Solstice® automated single-wafer platform with a suite of surface...

ACM Research Ships Its First 300mm, High-Temp Single-Wafer SPM Tool for Advanced Logic, DRAM and 3D-NAND Semiconductor Manufacturing

Sep 23, 2021

ACM Research, Inc. a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced it has shipped its first 300mm single-wafer Sulfuric Peroxide Mixture systems (Single-Wafer SPM tool) for wet clean and etch processes in advanced logic, DRAM and 3D-NAND integrated circuit manufacturing. ACM’s new...

Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)

Jul 24, 2017

In the first part of this series, I covered the perspectives of dimensional scaling vs. heterogeneous integration based on discussions during SEMICON West 2017. For part two, I spoke with equipment and material suppliers who serve either (or in some cases, both) the front- and back-ends of the semiconductor manufacturing...

3D By Design: PDKs Can Enable an Open Market for Interposer and 3D Solutions

Nov 25, 2014

As an integral part of the established integrated circuit (IC) supply chain, Outsourced Assembly and Test (OSAT) companies offer IC packaging services on the open market, independent of the chip manufacturer or foundry. OSATs are a subset of the total worldwide IC packaging market, since some IC package assembly is...

Fraunhofer IZM-ASSID’s System Approach to 3D

Aug 17, 2010

My recent visit to EV Group at its headquarters in Schärding, Austria, included some time spent with M. Jürgen Wolf, who, as part of his management and coordination of Fraunhofer IZM-ASSID (All System Silicon Integration Dresden) is the program & project manager for 3D Wafer Level System Integration (WLSI) and...