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The European semiconductor packaging community, together with its international colleagues, supply chain partners, customers and guests met for a full week fully dedicated to Semiconductor Packaging, Assembly and Test from September 9-13, 2024, at Mercure Hotel MOA Berlin and with it depicted the largest Packaging event in Europe in 2024....
Call me crazy, but after spending three days at the 2024 International Microelectronics and Packaging Society (IMAPS) Symposium in Boston learning about the latest industry trends and technology advancements, I think it’s time for the entire advanced packaging world to fully adopt the concepts of “Interconnectology” and “Interconnectologist”. The inspiration...
As we mentioned in IFTLE 537, IMAPS held the Onshoring: Packaging and Assembly Workshop prior to the traditional IMAPS fall symposium. Let’s take a look at what we learned from some of those key presentations. And then we’ll look at an important announcement by TSMC about its 3DFabric Alliance. Intel...
Chaired by 3D InCites Community member Steffen Kröhnert of ESPAT Consulting, the Electronics System-Integration Technology Conferences (ESTC) series is a premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications. This year, the event is being held in Sibiu,...
Longtime customer and leading VCSEL provider TRUMPF cites the value of Solstice’s key SP capabilities, performance, and footprint ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has expanded its flagship Solstice® automated single-wafer platform with a suite of surface...
As it has in recent years, SEMICON Europa 2019 featured a dedicated Advanced Packaging Conference. In this and my next post, we will look at some of the key presentations. In Jan Vardaman’s TechSearch presentation “Packaging Trends for Artificial Intelligence (AI)” she noted that the following package types would be...
NIJMEGEN, THE NETHERLANDS – May 15, 2019. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced it has received multi-system orders for its NEO 2000 and NEO 3000 series from a top ten OSAT based in Taiwan. This order will expand the existing NEO install base...
Rudolph continues to drive the technological innovation of its inspection and metrology products to deliver solutions that address the demanding needs across front- and back-end processes Wilmington, Mass. (September 6, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC) today launched two new inspection and metrology solutions for advanced semiconductor manufacturing: the Firefly™ System...
During the 2015 European 3D TSV Summit, I drove attendees to distraction by asking each presenter what success looked like to them for 3D integration. The resulting responses became a blog post, What Does Success for 3D Integration Look Like? Now, a year later, I decided to revisit the topic by...
In recent years, 2.5D packaging has quickly gained acceptance as an advanced packaging process, and the first products using this technology are now coming to market.¹ Most estimates project growth for 2.5D interposer packaging faster than the industry as a whole. Similar to the multi-chip modules (MCMs) of the past,...
