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As we mentioned in IFTLE 537, IMAPS held the Onshoring: Packaging and Assembly Workshop prior to the traditional IMAPS fall symposium. Let’s take a look at what we learned from some of those key presentations. And then we’ll look at an important announcement by TSMC about its 3DFabric Alliance. Intel...
Chaired by 3D InCites Community member Steffen Kröhnert of ESPAT Consulting, the Electronics System-Integration Technology Conferences (ESTC) series is a premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications. This year, the event is being held in Sibiu,...
In the Jan/Feb issue of ChipScale Review, there were two interesting articles on fan-out wafer-level packaging (FO-WLP) entitled “Eliminating Warpage for FOWLP during Debonding” by ERS Electronic GmbH and “Overcoming FOPLP Die Placement Error” by Onto Innovation …lets take a closer look. Eliminating Warpage for FOWLP during Debonding As we...
As it has in recent years, SEMICON Europa 2019 featured a dedicated Advanced Packaging Conference. In this and my next post, we will look at some of the key presentations. In Jan Vardaman’s TechSearch presentation “Packaging Trends for Artificial Intelligence (AI)” she noted that the following package types would be...
In April 2016, Fogale Nanotech Group acquired the assets of Altatech Semiconductor from Soitec in order to combine the metrology offerings of Fogale Nanotech Semicon with Altatech’s unique 2D and 3D inspection capabilities. The idea was to create a powerhouse of process control for emerging advanced packaging processes for next-generation...
Much has been written about the challenges that corporations face – especially established corporations – in adapting to a disruptive technology and the associated paradigm shifts. Most of the tomes on the subject focus on corporate management strategies. My intent is to discuss these challenges from a technology point of view...
One year ago, I visited Nordson DAGE at its R&D center in Colchester, to learn about the company’s latest foray into X-ray metrology at the production level with the launch of the XM8000. Rather than just using X-ray for inspection, this tool also analyzes the data to allow for full...
In recent years, 2.5D packaging has quickly gained acceptance as an advanced packaging process, and the first products using this technology are now coming to market.¹ Most estimates project growth for 2.5D interposer packaging faster than the industry as a whole. Similar to the multi-chip modules (MCMs) of the past,...
Tezzaron’s multi-project wafer program: participant perspectivesTo follow up with last week’s report on Tezzaron’s multi=project wafer program (MPW), I asked a few of the participants to share information about their part in the project, and the benefits of working in this paradigm. The first respondent was Donald Chiarulli, Professor...
The 2021 3D InCites Awards program recognized industry-wide contributions in the development of heterogeneous integration and 3D technologies. We expanded our scope of coverage, adding a special focus on sustainable manufacturing efforts, as well as diversity equity and inclusion (DEI) with two special award categories. Like every other awards event in the...
