Matches for your search: "fan-out wafer level packaging "
IMAPS‘ inaugural CHIPCon 2023 – the reinvention of its Advanced SiP Conference – took place July 24-27 in San Jose. Right out of the gate, it reminded me of the early days of RTI’s 3D ASIP Conference that I attended for nine straight Decembers in Burlingame, CA. The single-track format...
SUNNYVALE, Calif., May 31, 2023 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced its latest Fan-Out-Chip-on-Substrate-Bridge (FOCoS-Bridge) technology breakthrough, achieved through qualifying a large 70mm x 78mm package that incorporates two ASICs and eight High Bandwidth Memory (HBM)...
First system qualified at power semiconductor manufacturer in China FREMONT, Calif., Nov. 11, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that it has expanded its Ultra C pr product offering to include...
Breakthrough wafer-level optics technologies help solve a key challenge of connecting many fibers to silicon chips for datacom and telecom applications FLORIAN, Austria and JERUSALEM, March 2, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Teramount, the leader...
It goes without saying that 2021 was a monumental year for the semiconductor industry, and especially heterogeneous integration. Our industry hit mainstream media like never before, and suddenly the whole world understands the importance of semiconductors in our everyday lives. At 3D InCites, we spent 2021 covering the topics that...
Anyone whose anyone with a hand in the evolution of wafer level packaging will be in attendance or exhibiting at the 16th Annual International Wafer-Level Packaging Conference (IWLPC) and Tabletop Exhibition next week. 3D InCites will be there and we’re excited to engage and learn from the industry’s most respected...
I am convinced that increasing device complexity, higher quality requirements (e.g. automotive and medical), as well as the need for faster production ramp-ups, will force our industry to pay even more attention to design-in quality, expand self-test, even add redundancy to control logic and interconnects. In addition, wafer-probe and final...
Fan-out wafer level packaging (FO-WLP) is a disruptive technology that will have a significant impact on the electronics industry in the coming years. WLP has seen strong growth, especially in the mobile devices, because it provides a low-profile package that meets the requirements of many smartphone makers. Billions of WLPs...
As an integral part of the established integrated circuit (IC) supply chain, Outsourced Assembly and Test (OSAT) companies offer IC packaging services on the open market, independent of the chip manufacturer or foundry. OSATs are a subset of the total worldwide IC packaging market, since some IC package assembly is...
My recent visit to EV Group at its headquarters in Schärding, Austria, included some time spent with M. Jürgen Wolf, who, as part of his management and coordination of Fraunhofer IZM-ASSID (All System Silicon Integration Dresden) is the program & project manager for 3D Wafer Level System Integration (WLSI) and...
