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If you have been following the announcements from Bob Patti and his company, NHanced Semiconductors, it would not be surprising if you were a bit confused about how all these announcements will be coming together. I know IFTLE was, so we approached longtime friend Bob Patti and came up with...
IMAPS‘ inaugural CHIPCon 2023 – the reinvention of its Advanced SiP Conference – took place July 24-27 in San Jose. Right out of the gate, it reminded me of the early days of RTI’s 3D ASIP Conference that I attended for nine straight Decembers in Burlingame, CA. The single-track format...
Longtime customer and leading VCSEL provider TRUMPF cites the value of Solstice’s key SP capabilities, performance, and footprint ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has expanded its flagship Solstice® automated single-wafer platform with a suite of surface...
Hybrid bonding capability strongly complements SkyWater’s developing portfolio of heterogeneous integration solutions including silicon interposer and fan-out packaging KISSIMMEE, Fla. and SAN JOSE, Calif. – May 12, 2022 – SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, and Adeia, the newly launched brand for the IP licensing business of Xperi Holding Corporation (NASDAQ: XPER)...
Breakthrough wafer-level optics technologies help solve a key challenge of connecting many fibers to silicon chips for datacom and telecom applications FLORIAN, Austria and JERUSALEM, March 2, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Teramount, the leader...
ACM Research, Inc. a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced it has shipped its first 300mm single-wafer Sulfuric Peroxide Mixture systems (Single-Wafer SPM tool) for wet clean and etch processes in advanced logic, DRAM and 3D-NAND integrated circuit manufacturing. ACM’s new...
Anyone whose anyone with a hand in the evolution of wafer level packaging will be in attendance or exhibiting at the 16th Annual International Wafer-Level Packaging Conference (IWLPC) and Tabletop Exhibition next week. 3D InCites will be there and we’re excited to engage and learn from the industry’s most respected...
In the first part of this series, I covered the perspectives of dimensional scaling vs. heterogeneous integration based on discussions during SEMICON West 2017. For part two, I spoke with equipment and material suppliers who serve either (or in some cases, both) the front- and back-ends of the semiconductor manufacturing...
As an integral part of the established integrated circuit (IC) supply chain, Outsourced Assembly and Test (OSAT) companies offer IC packaging services on the open market, independent of the chip manufacturer or foundry. OSATs are a subset of the total worldwide IC packaging market, since some IC package assembly is...
My recent visit to EV Group at its headquarters in Schärding, Austria, included some time spent with M. Jürgen Wolf, who, as part of his management and coordination of Fraunhofer IZM-ASSID (All System Silicon Integration Dresden) is the program & project manager for 3D Wafer Level System Integration (WLSI) and...
