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August has been a thrilling month for the semiconductor industry, marked by notable achievements from our community members. From innovative new technological advancements and workforce development initiatives, to exciting industry events and partnerships, here’s a little about what our members have achieved. Technology Innovation: Lam Research has introduced Lam Cryo™...
In IFTLE 541 I mentioned funding from the government organization known as the Industrial Base Analysis and Sustainment Program (IBAS). I got offline questions about who they were and what they were doing. Since their latest program is now public, I can give you a little more information. IBAS IBAS...
A Technology Chasm Until recently, the world of IC fabrication was neatly divided into the distinct stages of front-end and back-end processing, with a large chasm separating them for both process complexity and economic value. The front end has been focused on increased processing or computing power and achieves this...
PWG5™ attacks 3D NAND process issues while Surfscan® SP7XP tackles 3nm logic defectivity Today KLA Corporation (NASDAQ: KLAC) announced two new products: the PWG5™ wafer geometry system and the Surfscan® SP7XP wafer defect inspection system. The new systems are designed to address exceedingly difficult issues in the manufacture of leading-edge memory...
At this year’s International Wafer-level Packaging Conference, almost 1000 semiconductor experts from all parts of the supply chain gathered at the DoubleTree Hotel in San Jose from October 23 to 25. Among them were also several electronic design automation (EDA) experts who discussed how to streamline die-package-board co-design. They explained...
Newport, United Kingdom, 22 May, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the launch of its Rapier XE system for 300mm wafer silicon etch processing. The new module offers significant advantages over competing systems as well...
CoatsClean™ combines process, equipment and formulation technology to deliver innovative, low cost-of-ownership approach to single-wafer photoresist and residue removal ST. FLORIAN, Austria and INDIANAPOLIS, Ind., June 17, 2013—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, and Dynaloy, LLC, an international manufacturer of chemicals for the electronics...
Applied Materials Inc. and the Institute of Microelectronics (IME), a research institute under the Agency for Science, Technology and Research (A*STAR), officially opened the Centre of Excellence in Advanced Packaging at Singapore's Science Park II today. Singapore's Minister for Trade and Industry, Mr. Lim Hng Kiang, presided at today's opening...
ST. FLORIAN, Austria, November 8, 2011 — EV Group (EVG) , a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shanghai Simgui Technology Co., Ltd. (Simgui), a leading Chinese wafer manufacturer, has placed a follow-on order for an EVG850 automated production...
When I opened Lee Smith’s email yesterday to find the updated agenda for Spring 2009 IMAPS Global Business Council, I thought maybe I’d died and gone to 3D heaven. Called “Supply Chain Development for 3D Packaging”, the agenda for this one-day event preceding the Device Packaging Symposium is jam-packed...
