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In IFTLE 541 I mentioned funding from the government organization known as the Industrial Base Analysis and Sustainment Program (IBAS). I got offline questions about who they were and what they were doing. Since their latest program is now public, I can give you a little more information. IBAS IBAS...
IR laser cleave technology enables nanometer-precision layer transfer through silicon, eliminating glass substrates for advanced packaging and enabling thin-layer 3D stacking EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced NanoCleave™, a revolutionary layer release technology for silicon...
Intel in Talks to Acquire GlobalFoundries Trustworthy sources such as the Wall Street Journal are reporting that Intel is in talks to acquire GlobalFoundries (GF). They report that the deal could value GF at around $30 billion. Talks appear to be directly between Intel and the Abu Dhabi government (which...
A Technology Chasm Until recently, the world of IC fabrication was neatly divided into the distinct stages of front-end and back-end processing, with a large chasm separating them for both process complexity and economic value. The front end has been focused on increased processing or computing power and achieves this...
PWG5™ attacks 3D NAND process issues while Surfscan® SP7XP tackles 3nm logic defectivity Today KLA Corporation (NASDAQ: KLAC) announced two new products: the PWG5™ wafer geometry system and the Surfscan® SP7XP wafer defect inspection system. The new systems are designed to address exceedingly difficult issues in the manufacture of leading-edge memory...
Continuing our look at presentations at the 2020 IWLPC, one of the themes of the conference was panel level processing. Canon Doug Shelton of Canon discussed “Submicron Lithography Enabling Panel Based Heterogeneous Integration”. While panel level processing (PLP) is efficient for large packages, processing equipment changes are required to process...
The Winter Games are over and the athletes returned home, and the SEMICON Korea 2018 teams from February have their sights on SEMICON China this month after all that snow-in-Seoul settled, but I still have a few more comments about the Electropackage System and Interconnect Product technical session SEMI organized...
Newport, United Kingdom, 22 May, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the launch of its Rapier XE system for 300mm wafer silicon etch processing. The new module offers significant advantages over competing systems as well...
CoatsClean™ combines process, equipment and formulation technology to deliver innovative, low cost-of-ownership approach to single-wafer photoresist and residue removal ST. FLORIAN, Austria and INDIANAPOLIS, Ind., June 17, 2013—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, and Dynaloy, LLC, an international manufacturer of chemicals for the electronics...
ST. FLORIAN, Austria, November 8, 2011 — EV Group (EVG) , a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shanghai Simgui Technology Co., Ltd. (Simgui), a leading Chinese wafer manufacturer, has placed a follow-on order for an EVG850 automated production...
