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August has been a thrilling month for the semiconductor industry, marked by notable achievements from our community members. From innovative new technological advancements and workforce development initiatives, to exciting industry events and partnerships, here’s a little about what our members have achieved. Technology Innovation: Lam Research has introduced Lam Cryo™...
SEMICON West 2024 is themed Stronger Together. SEMI’s message of the year is focused on the need for global collaboration and it carries through to this flagship event. From July 8-11, 2024. Join us in San Francisco at the Moscone Center for insights into semiconductor industry market trends and to...
The semiconductor and microelectronics industries are in the midst of a workforce crisis created by, among other things, the combination of explosive growth and a maturing workforce. Competition for STEM talent in other industries has made it difficult to recruit the latest generation of graduates, who are lured by seemingly...
TSMC recently held its 26th annual Technology Symposium, so let’s take a look at the highlights of their presentations focusing on their advanced packaging activities featuring a new concept called 3D fabric. But first, among the front-end highlights were the following: Scaling from the N7 to N5 to N3 process...
ECTC Meeting Goes Virtual For those that have not seen the announcement, the Electronics Component Technology Conference (ECTC) held annually the first week of June has been canceled. At the time of this writing, they are trying to assemble video presentations from the submissions and have a virtual conference. We’ll...
What’s on the agenda for the 2020 IMAPS Device Packaging Conference (DPC)? So much, and too much to share it all. Our 3D InCites Community members and sponsors are playing key roles… Booth 56: StratEdge Corporation StratEdge Corporation, a leader in the design, production, and assembly of high-frequency and high-power...
At this year’s International Wafer-level Packaging Conference, almost 1000 semiconductor experts from all parts of the supply chain gathered at the DoubleTree Hotel in San Jose from October 23 to 25. Among them were also several electronic design automation (EDA) experts who discussed how to streamline die-package-board co-design. They explained...
As Si interposer and 3D stacked memory devices enter into production, albeit in low volumes, semiconductor manufacturers are lining up their ducks to be ready for high volume manufacturing (HVM) when it happens. As a result, some suppliers of high volume manufacturing equipment who have been rather quiet through the...
Applied Materials Inc. and the Institute of Microelectronics (IME), a research institute under the Agency for Science, Technology and Research (A*STAR), officially opened the Centre of Excellence in Advanced Packaging at Singapore's Science Park II today. Singapore's Minister for Trade and Industry, Mr. Lim Hng Kiang, presided at today's opening...
When I opened Lee Smith’s email yesterday to find the updated agenda for Spring 2009 IMAPS Global Business Council, I thought maybe I’d died and gone to 3D heaven. Called “Supply Chain Development for 3D Packaging”, the agenda for this one-day event preceding the Device Packaging Symposium is jam-packed...
