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SEMICON West 2024 is themed Stronger Together. SEMI’s message of the year is focused on the need for global collaboration and it carries through to this flagship event. From July 8-11, 2024. Join us in San Francisco at the Moscone Center for insights into semiconductor industry market trends and to...
SUNNYVALE, Calif., May 31, 2023 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced its latest Fan-Out-Chip-on-Substrate-Bridge (FOCoS-Bridge) technology breakthrough, achieved through qualifying a large 70mm x 78mm package that incorporates two ASICs and eight High Bandwidth Memory (HBM)...
In IFTLE 541 I mentioned funding from the government organization known as the Industrial Base Analysis and Sustainment Program (IBAS). I got offline questions about who they were and what they were doing. Since their latest program is now public, I can give you a little more information. IBAS IBAS...
Continuing our look at presentations at the 2020 IWLPC, one of the themes of the conference was panel level processing. Canon Doug Shelton of Canon discussed “Submicron Lithography Enabling Panel Based Heterogeneous Integration”. While panel level processing (PLP) is efficient for large packages, processing equipment changes are required to process...
ECTC Meeting Goes Virtual For those that have not seen the announcement, the Electronics Component Technology Conference (ECTC) held annually the first week of June has been canceled. At the time of this writing, they are trying to assemble video presentations from the submissions and have a virtual conference. We’ll...
Fan-out wafer level packaging (FO-WLP) is a disruptive technology that will have a significant impact on the electronics industry in the coming years. WLP has seen strong growth, especially in the mobile devices, because it provides a low-profile package that meets the requirements of many smartphone makers. Billions of WLPs...
As Si interposer and 3D stacked memory devices enter into production, albeit in low volumes, semiconductor manufacturers are lining up their ducks to be ready for high volume manufacturing (HVM) when it happens. As a result, some suppliers of high volume manufacturing equipment who have been rather quiet through the...
Applied Materials Inc. and the Institute of Microelectronics (IME), a research institute under the Agency for Science, Technology and Research (A*STAR), officially opened the Centre of Excellence in Advanced Packaging at Singapore's Science Park II today. Singapore's Minister for Trade and Industry, Mr. Lim Hng Kiang, presided at today's opening...
ST. FLORIAN, Austria, November 8, 2011 — EV Group (EVG) , a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shanghai Simgui Technology Co., Ltd. (Simgui), a leading Chinese wafer manufacturer, has placed a follow-on order for an EVG850 automated production...
When I opened Lee Smith’s email yesterday to find the updated agenda for Spring 2009 IMAPS Global Business Council, I thought maybe I’d died and gone to 3D heaven. Called “Supply Chain Development for 3D Packaging”, the agenda for this one-day event preceding the Device Packaging Symposium is jam-packed...
