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The National Advanced Packaging Manufacturing Program (NAPMP) is one of multiple CHIPS R&D initiatives that seek to create United States (U.S.) leadership in advanced packaging and provide the technology and skilled workforce needed for packaging manufacturing in the U.S. NAPMP-funded activities and CHIPS manufacturing incentives seek to establish a self-sustaining,...
Amkor enables a resilient domestic semiconductor supply chain with the construction of its new advanced packaging facility in Arizona TEMPE, Ariz.–(BUSINESS WIRE)–Nov. 30, 2023– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, has announced its plan to build an advanced packaging and test facility...
In IFTLE 534 we discussed the DARPA Next Generation Microelectronics Manufacturing (NGMM) program which will attempt to establish a domestic center for producing silicon/non-silicon 3D heterogeneously integrated (3DHI) prototypes. In IFTLE 535 we discussed the upcoming US Semiconductor Fab resurgence, which will generate the need for more on-shore advanced packaging....
Reshoring With the ongoing deluge of reshoring activity in the US, it is good to see others pointing out that just manufacturing chips is not what we are after. As IFTLE has steadfastly stated, we need the complete infrastructure moved back onshore and that absolutely includes the new golden child:...
Over the past several years many companies have been extolling the virtues of glass as a packaging medium. Corning Glass, Schott Glass, and Asahi Glass have spent considerable funds on such endeavors. At the 2013 GaTech Interposer conference, for instance [ see IFTLE 180 “GaTech Interposer Conf ; Glass and...
Thomas Alva Edison didn’t invent semiconductor device packaging, but he might have, had he lived just one more generation. “I find out what the world needs. Then I go ahead and try to invent it.”* Edison passed away in 1931, less than twenty years before John Bardeen, Walter Brattain, and...
More than half of microelectromechanical systems MEMS packaging today is done by outsourced semiconductor and test services providers (OSATs) and Yole Développement (Yole) estimates OSATs’ market share will continue to grow in the next five years. The MEMS volume augmentation, especially for radio frequency (RF) applications, is making the MEMS...
The annual International Microelectronics and Packaging Society (IMAPS) International Symposium has always focused more on advancements in mainstream packaging technologies, and left the emerging innovative processes to its spring event, the International Device Packaging Conference. As such, its speakers generally offered the most conservative viewpoints on 3D adoption. In a...
Rudolph Technologies, Inc., provider of process characterization equipment and software for wafer fabs and advanced packaging facilities announced that it will collaborate with a process tool supplier and an IC device manufacturer in the development of 3D advanced semiconductor packaging applications. The development effort involves the integration of defect inspection...
Processes addressing the handling of ultra-thin wafers have been a hot topic ever since it became clear that they are vital to a multitude of semiconductor applications such as MEMS, compound semiconductors, LEDs, fan-out WLP, CMOS image sensors (CIS) and most recently, 3D IC using TSV interconnects.
