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The National Advanced Packaging Manufacturing Program (NAPMP) is one of multiple CHIPS R&D initiatives that seek to create United States (U.S.) leadership in advanced packaging and provide the technology and skilled workforce needed for packaging manufacturing in the U.S. NAPMP-funded activities and CHIPS manufacturing incentives seek to establish a self-sustaining,...
Amkor enables a resilient domestic semiconductor supply chain with the construction of its new advanced packaging facility in Arizona TEMPE, Ariz.–(BUSINESS WIRE)–Nov. 30, 2023– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, has announced its plan to build an advanced packaging and test facility...
In IFTLE 534 we discussed the DARPA Next Generation Microelectronics Manufacturing (NGMM) program which will attempt to establish a domestic center for producing silicon/non-silicon 3D heterogeneously integrated (3DHI) prototypes. In IFTLE 535 we discussed the upcoming US Semiconductor Fab resurgence, which will generate the need for more on-shore advanced packaging....
Reshoring With the ongoing deluge of reshoring activity in the US, it is good to see others pointing out that just manufacturing chips is not what we are after. As IFTLE has steadfastly stated, we need the complete infrastructure moved back onshore and that absolutely includes the new golden child:...
Over the past several years many companies have been extolling the virtues of glass as a packaging medium. Corning Glass, Schott Glass, and Asahi Glass have spent considerable funds on such endeavors. At the 2013 GaTech Interposer conference, for instance [ see IFTLE 180 “GaTech Interposer Conf ; Glass and...
More than half of microelectromechanical systems MEMS packaging today is done by outsourced semiconductor and test services providers (OSATs) and Yole Développement (Yole) estimates OSATs’ market share will continue to grow in the next five years. The MEMS volume augmentation, especially for radio frequency (RF) applications, is making the MEMS...
Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image sensors FLORIAN, Austria, May 16, 2017—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved...
The supply chain business model for manufacturing 3D stacked ICS has caused perhaps one of the hottest debates so far in commercializing 3D semiconductor processes. It’s easy to see why. Beyond the rather obvious question of who will own the liability of damaged devices, there’s a good deal of revenue...
Rudolph Technologies, Inc., provider of process characterization equipment and software for wafer fabs and advanced packaging facilities announced that it will collaborate with a process tool supplier and an IC device manufacturer in the development of 3D advanced semiconductor packaging applications. The development effort involves the integration of defect inspection...
Last year, it was all about through silicon vias (TSVs), this year, it’s all about everything else needed to achieve 3D IC stacks using TSVs. I’m talking about 3D IC technology discussions at this year’s SEMICON West. A clear example of this was SUSS MicroTec’s workshop on wafer thinning...
