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The National Advanced Packaging Manufacturing Program (NAPMP) is one of multiple CHIPS R&D initiatives that seek to create United States (U.S.) leadership in advanced packaging and provide the technology and skilled workforce needed for packaging manufacturing in the U.S. NAPMP-funded activities and CHIPS manufacturing incentives seek to establish a self-sustaining,...
Amkor enables a resilient domestic semiconductor supply chain with the construction of its new advanced packaging facility in Arizona TEMPE, Ariz.–(BUSINESS WIRE)–Nov. 30, 2023– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, has announced its plan to build an advanced packaging and test facility...
The semiconductor and microelectronics industries are in the midst of a workforce crisis created by, among other things, the combination of explosive growth and a maturing workforce. Competition for STEM talent in other industries has made it difficult to recruit the latest generation of graduates, who are lured by seemingly...
In IFTLE 534 we discussed the DARPA Next Generation Microelectronics Manufacturing (NGMM) program which will attempt to establish a domestic center for producing silicon/non-silicon 3D heterogeneously integrated (3DHI) prototypes. In IFTLE 535 we discussed the upcoming US Semiconductor Fab resurgence, which will generate the need for more on-shore advanced packaging....
Reshoring With the ongoing deluge of reshoring activity in the US, it is good to see others pointing out that just manufacturing chips is not what we are after. As IFTLE has steadfastly stated, we need the complete infrastructure moved back onshore and that absolutely includes the new golden child:...
TSMC recently held its 26th annual Technology Symposium, so let’s take a look at the highlights of their presentations focusing on their advanced packaging activities featuring a new concept called 3D fabric. But first, among the front-end highlights were the following: Scaling from the N7 to N5 to N3 process...
What’s on the agenda for the 2020 IMAPS Device Packaging Conference (DPC)? So much, and too much to share it all. Our 3D InCites Community members and sponsors are playing key roles… Booth 56: StratEdge Corporation StratEdge Corporation, a leader in the design, production, and assembly of high-frequency and high-power...
Thomas Alva Edison didn’t invent semiconductor device packaging, but he might have, had he lived just one more generation. “I find out what the world needs. Then I go ahead and try to invent it.”* Edison passed away in 1931, less than twenty years before John Bardeen, Walter Brattain, and...
The annual International Microelectronics and Packaging Society (IMAPS) International Symposium has always focused more on advancements in mainstream packaging technologies, and left the emerging innovative processes to its spring event, the International Device Packaging Conference. As such, its speakers generally offered the most conservative viewpoints on 3D adoption. In a...
Processes addressing the handling of ultra-thin wafers have been a hot topic ever since it became clear that they are vital to a multitude of semiconductor applications such as MEMS, compound semiconductors, LEDs, fan-out WLP, CMOS image sensors (CIS) and most recently, 3D IC using TSV interconnects.
