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Both events to take place March 3-7, 2025 in Phoenix, Arizona Device Packaging Conference – The event with the most advanced packaging content this winter The 21st Annual IMAPS Device Packaging Conference (DPC 2025) will be held March 3-6, 2025, at the Sheraton Grand at Wild Horse Pass in Phoenix,...
It is my honor to announce the winners of the 2022 3D InCites Awards. With 51 nominees in 11 categories, we had more participation than ever, and the competition was fierce! Thank you to this year’s platinum sponsors, ASE Group, EV Group and KLA; our gold sponsors, Evatec and YES, and...
One of the things that are missing from virtual events is the candid conversations we engage in when we meet up with industry colleagues in the halls and cocktail receptions at in-person events. In a way, that’s the tone we’re trying to capture in the conversations we have on the...
At the latest MEPTEC Luncheon, held February 5, 2020, and hosted by SEMI at its Milpitas HQ, Google’s Dr. Preeti S. Chauhan, Technical Program Manager for Data Center Quality, presented her perspectives on the benefits and challenges of advanced IC packaging technologies. Considering that Alphabet, Google’s parent company, controls about...
There are several different fan-out wafer-level packaging (FOWLP) technologies that are currently in high-volume production. The traditional fan-out (FO) technology as initially developed by Motorola and Infineon was a face down, die-first technology that has been in volume production for low-end baseband, PMIC, Codec, Wi-Fi, RF kind of applications since...
When I joined imec in October 2008 to work on test and design- for- test (DfT) of 3D-stacked integrated circuits (ICs), there were only a few test folks active in that emerging field. Consequently, misconceptions about 3D test were omnipresent. In the November 18, 2008 issue of Semiconductor International, Alexander...
According to the market research and strategy consulting company, Yole Développement (Yole), the polymeric materials market revenue will double over the next five years. Driven by movements towards further miniaturization and higher functionalities, megatrend applications like artificial intelligence (AI), 5G, and augmented/virtual reality (AR/VR) are creating huge business opportunities. Therefore,...
There’s no doubt about it. This is a good time to be in the microelectronics and packaging sector of the semiconductor industry. With exciting markets like artificial intelligence (AI), 5G, and the internet of things (IoT) technologies moving from ideas to implementation, this previously tired segment of the semiconductor industry...
ST. FLORIAN, Austria, June 1, 2011 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is collaborating with the Industrial Technology Research Institute (ITRI)—Taiwan’s largest and one of the world’s leading high-tech R&D institutions—in the...
The 2015 3D InCites Awards Judges represent each part of the 2.5D/3D IC ecosystem. This year’s panel includes industry, academia, market research, and R&D, as well as experts in design, test, processes, and manufacturing. Rozalia Beica, CTO, Yole Développement Rozalia Beica leads the Advanced Packaging Business Unit and Semiconductor Manufacturing...
