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It is my honor to announce the winners of the 2022 3D InCites Awards. With 51 nominees in 11 categories, we had more participation than ever, and the competition was fierce! Thank you to this year’s platinum sponsors, ASE Group, EV Group and KLA; our gold sponsors, Evatec and YES, and...
At the latest MEPTEC Luncheon, held February 5, 2020, and hosted by SEMI at its Milpitas HQ, Google’s Dr. Preeti S. Chauhan, Technical Program Manager for Data Center Quality, presented her perspectives on the benefits and challenges of advanced IC packaging technologies. Considering that Alphabet, Google’s parent company, controls about...
When I joined imec in October 2008 to work on test and design- for- test (DfT) of 3D-stacked integrated circuits (ICs), there were only a few test folks active in that emerging field. Consequently, misconceptions about 3D test were omnipresent. In the November 18, 2008 issue of Semiconductor International, Alexander...
According to the market research and strategy consulting company, Yole Développement (Yole), the polymeric materials market revenue will double over the next five years. Driven by movements towards further miniaturization and higher functionalities, megatrend applications like artificial intelligence (AI), 5G, and augmented/virtual reality (AR/VR) are creating huge business opportunities. Therefore,...
There’s no doubt about it. This is a good time to be in the microelectronics and packaging sector of the semiconductor industry. With exciting markets like artificial intelligence (AI), 5G, and the internet of things (IoT) technologies moving from ideas to implementation, this previously tired segment of the semiconductor industry...
Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image sensors FLORIAN, Austria, May 16, 2017—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved...
The supply chain business model for manufacturing 3D stacked ICS has caused perhaps one of the hottest debates so far in commercializing 3D semiconductor processes. It’s easy to see why. Beyond the rather obvious question of who will own the liability of damaged devices, there’s a good deal of revenue...
ST. FLORIAN, Austria, June 1, 2011 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is collaborating with the Industrial Technology Research Institute (ITRI)—Taiwan’s largest and one of the world’s leading high-tech R&D institutions—in the...
Last year, it was all about through silicon vias (TSVs), this year, it’s all about everything else needed to achieve 3D IC stacks using TSVs. I’m talking about 3D IC technology discussions at this year’s SEMICON West. A clear example of this was SUSS MicroTec’s workshop on wafer thinning...
The 2015 3D InCites Awards Judges represent each part of the 2.5D/3D IC ecosystem. This year’s panel includes industry, academia, market research, and R&D, as well as experts in design, test, processes, and manufacturing. Rozalia Beica, CTO, Yole Développement Rozalia Beica leads the Advanced Packaging Business Unit and Semiconductor Manufacturing...
