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Over the past several years many companies have been extolling the virtues of glass as a packaging medium. Corning Glass, Schott Glass, and Asahi Glass have spent considerable funds on such endeavors. At the 2013 GaTech Interposer conference, for instance [ see IFTLE 180 “GaTech Interposer Conf ; Glass and...
When I joined imec in October 2008 to work on test and design- for- test (DfT) of 3D-stacked integrated circuits (ICs), there were only a few test folks active in that emerging field. Consequently, misconceptions about 3D test were omnipresent. In the November 18, 2008 issue of Semiconductor International, Alexander...
According to the market research and strategy consulting company, Yole Développement (Yole), the polymeric materials market revenue will double over the next five years. Driven by movements towards further miniaturization and higher functionalities, megatrend applications like artificial intelligence (AI), 5G, and augmented/virtual reality (AR/VR) are creating huge business opportunities. Therefore,...
More than half of microelectromechanical systems MEMS packaging today is done by outsourced semiconductor and test services providers (OSATs) and Yole Développement (Yole) estimates OSATs’ market share will continue to grow in the next five years. The MEMS volume augmentation, especially for radio frequency (RF) applications, is making the MEMS...
Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image sensors FLORIAN, Austria, May 16, 2017—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved...
The supply chain business model for manufacturing 3D stacked ICS has caused perhaps one of the hottest debates so far in commercializing 3D semiconductor processes. It’s easy to see why. Beyond the rather obvious question of who will own the liability of damaged devices, there’s a good deal of revenue...
Rudolph Technologies, Inc., provider of process characterization equipment and software for wafer fabs and advanced packaging facilities announced that it will collaborate with a process tool supplier and an IC device manufacturer in the development of 3D advanced semiconductor packaging applications. The development effort involves the integration of defect inspection...
ST. FLORIAN, Austria, June 1, 2011 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is collaborating with the Industrial Technology Research Institute (ITRI)—Taiwan’s largest and one of the world’s leading high-tech R&D institutions—in the...
Last year, it was all about through silicon vias (TSVs), this year, it’s all about everything else needed to achieve 3D IC stacks using TSVs. I’m talking about 3D IC technology discussions at this year’s SEMICON West. A clear example of this was SUSS MicroTec’s workshop on wafer thinning...
The 2015 3D InCites Awards Judges represent each part of the 2.5D/3D IC ecosystem. This year’s panel includes industry, academia, market research, and R&D, as well as experts in design, test, processes, and manufacturing. Rozalia Beica, CTO, Yole Développement Rozalia Beica leads the Advanced Packaging Business Unit and Semiconductor Manufacturing...
