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Company expansion driven by market growth in 3D/heterogeneous integration fueling strong demand for EVG hybrid bonding and other leading process solutions FLORIAN, Austria, November 28, 2023—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed construction...
A Technology Chasm Until recently, the world of IC fabrication was neatly divided into the distinct stages of front-end and back-end processing, with a large chasm separating them for both process complexity and economic value. The front end has been focused on increased processing or computing power and achieves this...
New HI Competence Center to help customers accelerate new product development fueled by heterogeneous integration and advanced packaging EV Group (EVG) today announced that it has established the Heterogeneous Integration Competence Center™, which is designed to assist customers in leveraging EVG’s process solutions and expertise to enable new and enhanced...
There are several different fan-out wafer-level packaging (FOWLP) technologies that are currently in high-volume production. The traditional fan-out (FO) technology as initially developed by Motorola and Infineon was a face down, die-first technology that has been in volume production for low-end baseband, PMIC, Codec, Wi-Fi, RF kind of applications since...
Without a doubt, 5G has arrived and various key smartphone OEMs have already announced products that will support 5G cellular and connectivity. It is clear for everyone that 5G will totally redefine how the radio frequency (RF) front-end interacts in-between the network and the modem. The new RF bands (sub-6...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that IHP – Innovations for High-Performance Microelectronics (IHP), a German research institute for silicon-based systems, highest-frequency integrated circuits, and technologies for wireless and broadband communication, has purchased an EVG®...
For the first time ever, the Materials Research Society (MRS) brought its annual Spring meeting to Phoenix. I have never attended this event, as it is deeply academic, and has not been on my radar for 3D or advanced packaging technologies. However, after finding out from fellow SemiSisters, Rozalia Beica,...
This year’s keynote talks at the 2016 IMAPS Device Packaging Conference (DPC 2016) provided some new insight into a number of interesting areas of importance to the advanced packaging community. I already addressed Bill Chen’s talk, which focused on system-in-package (SiP) and introduced a 3D Fan-out SiP approach. Here, I’ll...
The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11 After 50 years of following Moore’s Law and reaping major benefits with every feature size reduction, the economics of transistor scaling are now no longer universally applicable. Only designs that can be sold in extremely high volumes are likely to...
Enables fine-pitch connections for 3D applications, including image sensors, memory and 3D SoCs RESEARCH TRIANGLE PARK, N.C., May 27, 2014 – Ziptronix Inc. and EV Group (“EVG”) today announced they have successfully achieved submicron post-bond alignment accuracy on customer-provided 300mm DRAM wafers. The results were achieved by implementing Ziptronix’s DBI®...
