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Automotive compute processors are rapidly adopting advanced process nodes. NXP announced the development of 5nm automotive processors in 2020 [1], Mobileye announced EyeQ Ultra using 5nm technology during CES 2022 [2], and TSMC announced its “Auto Early” 3nm processes in 2023 [3]. In the past, the automotive industry was slow...
With the increasing expectations and demands of customers of electronic equipment, the manufacturing technologies applied are also propelled due to rising requirements. Powerful wearables, the Internet of Things (IoT), mobile communication devices, and new huge data storage subsystems push the semiconductor industry and the electronics designers to new heights, and...
Heterogeneous IC packaging is here. It is already in production, and increasingly more customers are developing and qualifying their products at Amkor and in other outsourced semiconductor assembly and test (OSAT) suppliers and foundry providers. The rationale for this surge into new multi-die embodiments has been well documented and discussed....
ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is adding the Automatic Panel Debond Machine 650 (APDM650) to its portfolio of equipment for Advanced Packaging. ERS’s Manual Panel Debond Machine (MPDM), quickly gained traction in the industry after it was announced in 2018,...
In September of 2018, I spoke with KLA’s Stephen Hiebert and Pieter Vandewalle about the changing advanced packaging landscape, and the need for better process control that inspired the company’s foray into the advanced packaging space. With the introduction of its IC packaging portfolio that comprised the Kronos™ 1080 and...
We are pleased to announce the winners of the 2018 3D InCites Awards, sponsored by KLA-Tencor and EV Group and hosted by iMAPS. This may have been the most exciting awards year yet, with 40 nominees from 26 companies and four research institutes competing for awards in 9 categories. The...
While most of the research institutes in the US and Asia have been focused on commercializing 3D integration technologies for mass markets such as mobile devices and consumer electronics, one US-based research institute has followed a different path more similar to that of the European research centers; focusing its 3D...
While other presenters for the 2013 3D ASIP session, “Evolution of 3D Technologies and Market Trends” took a more conventional approach to reporting the status of 3D integration, Jan Vardaman, TechSearch International gets the prize for originality and humor for playing the role of “professor” and delivering the 3D readiness...
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability
2022 3D InCites Awards Winner Circle The 2022 3D InCites Awards program recognized industry-wide contributions in the development of heterogeneous integration and 3D technologies. In 2021, we added two awards to recognize companies that demonstrate best practices in sustainable manufacturing efforts, as well as diversity equity and inclusion (DEI). Below are the...
