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Automotive compute processors are rapidly adopting advanced process nodes. NXP announced the development of 5nm automotive processors in 2020 [1], Mobileye announced EyeQ Ultra using 5nm technology during CES 2022 [2], and TSMC announced its “Auto Early” 3nm processes in 2023 [3]. In the past, the automotive industry was slow...
Our 3D InCites Community Members had an abundant amount of news to share this month, so we thought we should do a quick recap in our June edition of monthly highlights. If you have news to share, please don’t forget to share it with your 3D InCites team! ASE announced...
With the increasing expectations and demands of customers of electronic equipment, the manufacturing technologies applied are also propelled due to rising requirements. Powerful wearables, the Internet of Things (IoT), mobile communication devices, and new huge data storage subsystems push the semiconductor industry and the electronics designers to new heights, and...
Heterogeneous IC packaging is here. It is already in production, and increasingly more customers are developing and qualifying their products at Amkor and in other outsourced semiconductor assembly and test (OSAT) suppliers and foundry providers. The rationale for this surge into new multi-die embodiments has been well documented and discussed....
In September of 2018, I spoke with KLA’s Stephen Hiebert and Pieter Vandewalle about the changing advanced packaging landscape, and the need for better process control that inspired the company’s foray into the advanced packaging space. With the introduction of its IC packaging portfolio that comprised the Kronos™ 1080 and...
2019 has been a sobering year for the semiconductor industry. It started out with such high hopes, coming off of a banner year in 2018, during which we hit some significant milestones. Now we find ourselves in the midst of the worst downturn since 2008, minus the global financial crisis,...
While most of the research institutes in the US and Asia have been focused on commercializing 3D integration technologies for mass markets such as mobile devices and consumer electronics, one US-based research institute has followed a different path more similar to that of the European research centers; focusing its 3D...
While other presenters for the 2013 3D ASIP session, “Evolution of 3D Technologies and Market Trends” took a more conventional approach to reporting the status of 3D integration, Jan Vardaman, TechSearch International gets the prize for originality and humor for playing the role of “professor” and delivering the 3D readiness...
So there I was, listening to Eric Beyne talk about the importance of co-developing advanced CMOS and 3D ICs because one directly affects the other, when my thoughts turned to once again to FinFets (is this what he means by advanced CMOS?) I wondered whether these so-called 3D transistor structures...
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability
