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US-China CHIP WARS Now Encompass Advanced Packaging In the Aug 21st issue of Asia Times, Scott Foster wrote an interesting article entitled “Advanced IC Packaging is Next Front in the Chip Wars”; certainly something we all see happening. Certainly, IFTLE agrees that advanced IC packaging is the new source of...
Hybrid bonding enables an assortment of possible chip architectures, mainly targeted at high-end applications including high-performance computing (HPC), artificial intelligence (AI), servers, and data centers. As the technology matures, further growth is projected into consumer applications, memory devices including high bandwidth memory (HBM), and mobile and automotive applications that could...
ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is adding the Automatic Panel Debond Machine 650 (APDM650) to its portfolio of equipment for Advanced Packaging. ERS’s Manual Panel Debond Machine (MPDM), quickly gained traction in the industry after it was announced in 2018,...
We are pleased to announce the winners of the 2018 3D InCites Awards, sponsored by KLA-Tencor and EV Group and hosted by iMAPS. This may have been the most exciting awards year yet, with 40 nominees from 26 companies and four research institutes competing for awards in 9 categories. The...
Used either as a permanent or as a temporary material within the semiconductor manufacturing processes, glass plays a key role in the semiconductor industry. It is today already implemented as a mature solution, in several market segments such as infrared (IR) cut filter for CMOS image sensor (CIS) technology, microfluidics...
First-ever Integration of In-line Metrology with Temporary Bonding/Debonding Enables More Repeatable and Reliable Process, Improved Yields and Lower Cost of Production ST. FLORIAN, Austria, June 21, 2011 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it...
EVG System Enables Void-free Wafer Bonding of III-V Compound Semiconductor Materials on Silicon Wafers with High-quality Surface Preparation TOKYO, JAPAN, September 29, 2010 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor markets, today announced it has received an order from...
2022 3D InCites Awards Winner Circle The 2022 3D InCites Awards program recognized industry-wide contributions in the development of heterogeneous integration and 3D technologies. In 2021, we added two awards to recognize companies that demonstrate best practices in sustainable manufacturing efforts, as well as diversity equity and inclusion (DEI). Below are the...
