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India is a rapidly growing consumer of semiconductors. Its market was $22 billion in 2019 and is expected to nearly triple to $64 billion by 2026, according to Counterpoint Technology Market Research. By 2030 they expect to account for 10% of global consumption. This past March, India announced a major...
Hybrid bonding enables an assortment of possible chip architectures, mainly targeted at high-end applications including high-performance computing (HPC), artificial intelligence (AI), servers, and data centers. As the technology matures, further growth is projected into consumer applications, memory devices including high bandwidth memory (HBM), and mobile and automotive applications that could...
IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and we at 3D InCites are very excited! There are over 300 attendees registered and the show floor and hotel are sold out. It’s been two years since the event took...
The IMAPS 2021 program is set to be knowledge-packed, offering materials both in person and on demand, including keynote presentations from top experts, professional development courses, numerous technical sessions and over a dozen posters. Our 3D InCites community members are playing a large role in dispersing this knowledge through their...
It was in 1992 when Ted Tessier and I, in our paper, “Overview of MCM Technologies: MCM-D”, at the IMAPS Symposium in San Francisco, drew the analogy to the evolving LCD industry. “The LCD industry had spawned the development of a whole new class of large format, high-throughput thin-film processing...
Used either as a permanent or as a temporary material within the semiconductor manufacturing processes, glass plays a key role in the semiconductor industry. It is today already implemented as a mature solution, in several market segments such as infrared (IR) cut filter for CMOS image sensor (CIS) technology, microfluidics...
“Advanced substrates are the key interconnect component of advanced packaging architectures,” comments Andrej Ivankovic, Technology & Market Analyst, Advanced Packaging & Semiconductor Manufacturing at Yole Développement (Yole). Indeed advanced substrates are critical in enabling future products and markets. To answer to technology evolution and market needs, Yole’s advanced packaging team...
Just under a week away, the agenda for the 2017 IMAPS Device Packaging Conference and co-located Global Business Council is geared to inspire attendees about the growing importance of heterogeneous integration technologies supported by advanced wafer level packaging, 2.5D, and 3D integration. While the quest for smaller silicon nodes continues,...
System integration is moving forward. Denser and high performing systems require advanced packaging, assembly, and test players to move closer together, and they mandatorily need to be involved in the collaboration along the full supply and value chain from the early beginning of new projects. The package is becoming a...
For the first time since the 3D Architectures for Semiconductor Integration and Packaging (3DASIP) Conference was established, the organizing committee decided to acknowledge the work of two researchers who were instrumental in developing the core processes that enabled 3D TSV development. In a brief ceremony, Dr. Phil Garrou presented 3DIC Pioneer...
