Matches for your search: "fan-out wafer level packaging "
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. About 1,500 professionals from the global microelectronics packaging industry are set to gather next week...
The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). Conference attendees can expect more than 65 on-demand session speakers across three technical tracks and 16 sessions. Recorded technical...
On my annual trek around the ECTC Technology Corner, I’m always on the look-out for something new to write about. This year, it quickly became clear by the number of exhibitors displaying their product samples, that one of my blogs would be an update on fan-out panel-level packaging. For the...
As the semiconductor industry shifts focus from CMOS scaling to heterogeneous integration, the importance of surface preparation and wafer cleans during semiconductor device manufacturing is migrating from front-end wafer processing to back-end wafer level packaging processes. This, due to a combination of high-reliability applications, such as autonomous vehicles, 5G, artificial...
“Fan-out packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and part of the Semiconductor & Software team at Yole Développement (Yole). “New milestones are achieved by SEMCO and PTI with fan-out panel level packaging (FOPLP) technology. Both companies have invested...
Fan-out wafer-level packaging (FOWLP) is a cost-effective way to achieve high interconnect density and to manage larger I/O counts within an affordable package. It enables smaller footprints, higher interconnect density, better routing and thinner packages than current technologies. [1] A standard FOWLP wafer comprises known good die (KGD) and a...
In the fast-growing fan-out market showing 80% increase between 2015 and 2017[1], it is today essential to deeply understand the patent strategies of the key players. The Technology Intelligence & Intellectual Property (IP) Strategy Company, KnowMade has thoroughly investigated the fan-out packaging patent landscape and releases today the new patent...
“It is better to be first than it is to be better.” (Ries and Trout, in The 22 Immutable Laws of Marketing.) Or is it “Fast Followers Not First Movers Are The Real Winners?” Fan-Out Wafer Level Packaging has built up such a head of steam this year (see “iPhone...
There is no doubt about it, 2016 is turning out to be the year of fan-out wafer level packaging (FOWLP) as the entire semiconductor industry turns to advanced wafer level packaging and system-in-package solutions to take the world to its next generation of connectivity, in which our smartphones drive our...
2016 is a turning point for the Fan-Out packaging market since both leaders, Apple and TSMC changed the game and may create a trend of acceptance of fan-out packages. Yole Développement (Yole) is analyzing the current market and technologies trends and offers you to discover these results within a new...
