ERS Now Offers its Technology for Fan-out Debonding and Warpage Adjustment in a Fully-automatic Machine for Panels up to 650 x 650 mm
ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is adding the Automatic Panel Debond Machine 650 (APDM650) to its portfolio of equipment for Advanced Packaging. ERS’s Manual Panel Debond Machine (MPDM), quickly gained traction in the industry after it was announced in 2018,...