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Get ready, because the IMAPS International Symposium on Microelectronics is coming up quickly. As the event continues its very impressive run of 57 years, this year’s symposium will take place from September 30 – October 3 at the Encore Boston Harbor. With 15 3D InCites Community Members presenting and 20...
SEMI and TechSearch International collaborate on a new edition of database tracking 33% more facilities and highlights advanced packaging and factory certifications MILPITAS, Calif. – March 18, 2024 – The new edition of the Worldwide Assembly & Test Facility Database expands coverage to 670 facilities, 33% more than the previous release, including...
The top global event for advanced Chiplet and Heterogeneous Integration Packaging (CHIP) technologies to be held in July 2023 IMAPS has rebranded its well-attended, annual Advanced System-in-Package conference to the Chiplet & Heterogeneous Integration Packaging Conference (CHIPcon). As the world’s leading semiconductor companies continue to push the edge of process...
EVG®320 D2W die preparation and activation system provides seamless integration with third-party die bonders; completes EVG’s equipment portfolio for end-to-end hybrid bonding for 3D/Heterogeneous Integration EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today introduced the EVG®320 D2W die...
At this year’s International Wafer-level Packaging Conference, almost 1000 semiconductor experts from all parts of the supply chain gathered at the DoubleTree Hotel in San Jose from October 23 to 25. Among them were also several electronic design automation (EDA) experts who discussed how to streamline die-package-board co-design. They explained...
For the fifth consecutive year, the European 3D Summit returns to Grenoble, January 23-25, 2017. The event has evolved over those years, beginning its tenure as the 3D TSV Summit, then last year re-branded as the 3D Summit in acknowledgment that not everything in 3D has to do with through...
Staying relevant in the ever-expanding technology landscape that is the semiconductor packaging industry can be a struggle for an event that’s been laser-focused on one emerging segment since its inception. But this past week, 3D Architectures for Semiconductor Integration and Packaging (3D ASIP 2015) delivered a program that not only addressed...
GEMINI®FB XT surpasses ITRS requirements for wafer bonding with up to 3X improvement in wafer-to-wafer alignment; enhanced productivity enables 50 percent increased throughput. ST. FLORIAN, Austria, June 30, 2014—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the...
The way I see it, it was only a matter of time before Nordson DAGE brought its X-ray technology into the 2.5D and 3D IC space. The company has long been the leader for X-ray inspection in the electronics market and is now positioned to address the growing need for...
Order from Sensonor Enables EVG to Leverage Decades-long Expertise in Wafer Bonding to Support Emerging, High-growth MEMS Market SEMICON EUROPA, Dresden, Germany, October 18, 2010 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received...
