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Now that imec’s Luc Van den hove declared advanced packaging is key to the advancement of semiconductors, everyone in the industry needs to catch up to those who have been following the course of these technologies while they were in development. The Advanced Packaging Conference (APC) at SEMICON Europa 2024...
SEMI and TechSearch International collaborate on a new edition of database tracking 33% more facilities and highlights advanced packaging and factory certifications MILPITAS, Calif. – March 18, 2024 – The new edition of the Worldwide Assembly & Test Facility Database expands coverage to 670 facilities, 33% more than the previous release, including...
The top global event for advanced Chiplet and Heterogeneous Integration Packaging (CHIP) technologies to be held in July 2023 IMAPS has rebranded its well-attended, annual Advanced System-in-Package conference to the Chiplet & Heterogeneous Integration Packaging Conference (CHIPcon). As the world’s leading semiconductor companies continue to push the edge of process...
Major Foundry Investments in the US Samsung, Intel, and TSMC are all making large foundry investments in the US. First reported in May, Samsung Electronics is reportedly now close to finalizing the site selection for its new $17B foundry in the United States. The investment would create a second foundry,...
For the fifth consecutive year, the European 3D Summit returns to Grenoble, January 23-25, 2017. The event has evolved over those years, beginning its tenure as the 3D TSV Summit, then last year re-branded as the 3D Summit in acknowledgment that not everything in 3D has to do with through...
Staying relevant in the ever-expanding technology landscape that is the semiconductor packaging industry can be a struggle for an event that’s been laser-focused on one emerging segment since its inception. But this past week, 3D Architectures for Semiconductor Integration and Packaging (3D ASIP 2015) delivered a program that not only addressed...
GEMINI®FB XT surpasses ITRS requirements for wafer bonding with up to 3X improvement in wafer-to-wafer alignment; enhanced productivity enables 50 percent increased throughput. ST. FLORIAN, Austria, June 30, 2014—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the...
The way I see it, it was only a matter of time before Nordson DAGE brought its X-ray technology into the 2.5D and 3D IC space. The company has long been the leader for X-ray inspection in the electronics market and is now positioned to address the growing need for...
EVG560HBL Significantly Increases Throughput for Volume HB-LED Production
Order from Sensonor Enables EVG to Leverage Decades-long Expertise in Wafer Bonding to Support Emerging, High-growth MEMS Market SEMICON EUROPA, Dresden, Germany, October 18, 2010 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received...
