Matches for your search: "fan-out wafer level packaging "
3D InCites is excited to be the official industry partner of the 2025 IMAPS Device Packaging Conference (DPC) this March. With such a strong member presence this year, I’m looking forward to meeting so many of you during the course of the event! Taking place from March 3-6 in Phoenix...
New double-sided bevel etching system enhances process efficiency and reliability in copper-related applications, supporting high-precision features on large panels ACM Research, Inc. (ACM), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced the launch of its Ultra C bev-p panel bevel etching tool for...
MUNICH, May 30th, 2023 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, has developed first-of-its-kind equipment for the metrology and analysis of warped wafers. Thanks to its advanced optical scanning methodology, Wave3000 can accurately measure wafer deformities in specific handling positions. It...
Over its 17 years of existence, the IWLPC has morphed from a conference focused on wafer-level packaging to one basically focused on anything advanced packaging. It is organized by SMTA and Chip Scale Review. Let’s first take a closer look at some of this year’s virtual presentations by Samsung. Samsung...
The 2020 International Wafer Level Packaging Conference (Virtual IWLPC) brought up the caboose of several weeks of virtual conferences that for me started with SEMICON Taiwan and included IMAPS International Symposium. The content featured one keynote, a panel discussion, 40 technical presentations, and 23 virtual exhibits where you can access...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received multiple orders for its comprehensive portfolio of manufacturing equipment and services designed to address the burgeoning demand for wafer-level optics (WLO) and 3D sensing. The market-leading...
Multichip module (MCM), system-in-package (SiP), system-on-chip (SoC), and heterogeneous integration are all important semiconductor packaging technologies. They deserve to have, at the very least, a book written about them. However, herein I would like to give these technologies very simple descriptions. if you don’t mind. MCM MCM integrates different chips and...
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach US$ 4.6 billion in 2020, against US$ 2.2 billion in 2015, announces Yole Développement (Yole). This market is showing an impressive 16%...
Consider for a moment that the ultimate goal of 3D integration is not to achieve high volume manufacturing (HVM) in high bandwidth memory and logic applications for mobile devices, but rather to be an enabler for heterogeneous integration of disparate technologies for everything from medical and automotive applications to industrial...
All hell broke loose at the 3D Panel discussion at the 2014 IMAPS International Device Packaging Conference. Nobody was hurt, and nothing got thrown, mind you, but it’s clear that we’ve got some very different opinions regarding one of my pet peeves – the ever-expanding and increasingly complex advanced packaging...
