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New double-sided bevel etching system enhances process efficiency and reliability in copper-related applications, supporting high-precision features on large panels ACM Research, Inc. (ACM), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced the launch of its Ultra C bev-p panel bevel etching tool for...
Melville, NY (November 27, 2023) – Micross Components (“Micross”), a leading provider of high-reliability microelectronic products and services for aerospace, defense, space, medical, energy, and other high-reliability applications, is pleased to announce that it has received an award under the IBAS Cornerstone RESHAPE program with a ceiling value of up...
Every now and then you run across a paper or presentation, and you say to yourself, “This clearly explains this or that technology…this is an important paper”. When I do that, I try to share them with you on IFTLE. In this case, I’m talking about the paper “2.3D Hybrid...
Over its 17 years of existence, the IWLPC has morphed from a conference focused on wafer-level packaging to one basically focused on anything advanced packaging. It is organized by SMTA and Chip Scale Review. Let’s first take a closer look at some of this year’s virtual presentations by Samsung. Samsung...
The 2020 International Wafer Level Packaging Conference (Virtual IWLPC) brought up the caboose of several weeks of virtual conferences that for me started with SEMICON Taiwan and included IMAPS International Symposium. The content featured one keynote, a panel discussion, 40 technical presentations, and 23 virtual exhibits where you can access...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received multiple orders for its comprehensive portfolio of manufacturing equipment and services designed to address the burgeoning demand for wafer-level optics (WLO) and 3D sensing. The market-leading...
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach US$ 4.6 billion in 2020, against US$ 2.2 billion in 2015, announces Yole Développement (Yole). This market is showing an impressive 16%...
Consider for a moment that the ultimate goal of 3D integration is not to achieve high volume manufacturing (HVM) in high bandwidth memory and logic applications for mobile devices, but rather to be an enabler for heterogeneous integration of disparate technologies for everything from medical and automotive applications to industrial...
All hell broke loose at the 3D Panel discussion at the 2014 IMAPS International Device Packaging Conference. Nobody was hurt, and nothing got thrown, mind you, but it’s clear that we’ve got some very different opinions regarding one of my pet peeves – the ever-expanding and increasingly complex advanced packaging...
EVG560HBL Significantly Increases Throughput for Volume HB-LED Production
