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SEMI and TechSearch International collaborate on a new edition of database tracking 33% more facilities and highlights advanced packaging and factory certifications MILPITAS, Calif. – March 18, 2024 – The new edition of the Worldwide Assembly & Test Facility Database expands coverage to 670 facilities, 33% more than the previous release, including...
This is by far my favorite blog post to write each year; the one where I get to announce the winners of the 3D InCites Awards. This year we had 36 nominees for 10 2023 3D InCites Awards categories, representing companies from around the world, all working to advance the...
Every now and then you run across a paper or presentation, and you say to yourself, “This clearly explains this or that technology…this is an important paper”. When I do that, I try to share them with you on IFTLE. In this case, I’m talking about the paper “2.3D Hybrid...
The 2020 International Wafer Level Packaging Conference (Virtual IWLPC) brought up the caboose of several weeks of virtual conferences that for me started with SEMICON Taiwan and included IMAPS International Symposium. The content featured one keynote, a panel discussion, 40 technical presentations, and 23 virtual exhibits where you can access...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Leti, an institute of CEA Tech, today announced the world’s first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron). This breakthrough also achieved...
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach US$ 4.6 billion in 2020, against US$ 2.2 billion in 2015, announces Yole Développement (Yole). This market is showing an impressive 16%...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received multiple orders for its GEMINI® FB XT automated fusion wafer bonders from multiple leading device manufacturers. The GEMINI FB XT offers industry leading wafer-to-wafer alignment...
Consider for a moment that the ultimate goal of 3D integration is not to achieve high volume manufacturing (HVM) in high bandwidth memory and logic applications for mobile devices, but rather to be an enabler for heterogeneous integration of disparate technologies for everything from medical and automotive applications to industrial...
All hell broke loose at the 3D Panel discussion at the 2014 IMAPS International Device Packaging Conference. Nobody was hurt, and nothing got thrown, mind you, but it’s clear that we’ve got some very different opinions regarding one of my pet peeves – the ever-expanding and increasingly complex advanced packaging...
The Northern California Chapter of the America Vacuum Society has, for years, run a very strong program of ongoing User Group Meetings focused around Plasma Applications, CMP, Thin Films, Junction Technology, and PV. Individually, these worthwhile User Group Meetings, graciously hosted by SEMI at SEMI HQ in San Jose, allow speakers...
