Matches for your search: "fan-out wafer level packaging "
This is by far my favorite blog post to write each year; the one where I get to announce the winners of the 3D InCites Awards. This year we had 36 nominees for 10 2023 3D InCites Awards categories, representing companies from around the world, all working to advance the...
IMAPS held its 55th International Symposium on Microelectronics in Boston, October 4-6 2022. The conference drew some 900+ attendees hungry for some post-pandemic social contact. It was somewhat of a homecoming for me since my career started in the Boston suburbs where I worked for 12 years (1975 – 1986) at Dow...
2017 saw a clear breakthrough for 3D chip technology in commercial products. Before then, the industry had looked rather skeptically at 3D, but now it is beginning to realize that 3D does not necessarily have to cost more money. Better still, it creates new possibilities and opportunities. 3D on...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Leti, an institute of CEA Tech, today announced the world’s first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron). This breakthrough also achieved...
Multichip module (MCM), system-in-package (SiP), system-on-chip (SoC), and heterogeneous integration are all important semiconductor packaging technologies. They deserve to have, at the very least, a book written about them. However, herein I would like to give these technologies very simple descriptions. if you don’t mind. MCM MCM integrates different chips and...
Part two of a five-part series. How did we determine which technologies are “the Big Five,” for semiconductor packaging? Essentially, we identified the five key platforms that we believe will be leveraged across a multitude of applications and markets now and in the future. The selected platforms are low-cost flip chip,...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received multiple orders for its GEMINI® FB XT automated fusion wafer bonders from multiple leading device manufacturers. The GEMINI FB XT offers industry leading wafer-to-wafer alignment...
In a recent blog sharing my impressions of July’s Semicon West, I complained a bit about the lack of substantial IC packaging topics at this large IC manufacturing conference and also mentioned that I had observed the same problem at June’s Design Automation Conference. I am glad that I was fairly...
TechSearch International Analyzes Flip Chip and Wafer Level Package Growth Flip chip and wafer level package (WLPs) shipments continue to increase. TechSearch International’s new study, 2015 Flip Chip and WLP: Emerging Trends and Market Forecasts, provides unparalleled analysis of what’s behind the numbers for the growth of flip chip and...
The Northern California Chapter of the America Vacuum Society has, for years, run a very strong program of ongoing User Group Meetings focused around Plasma Applications, CMP, Thin Films, Junction Technology, and PV. Individually, these worthwhile User Group Meetings, graciously hosted by SEMI at SEMI HQ in San Jose, allow speakers...
