Matches for your search: "fan-out wafer level packaging "
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act. Amkor announced in November 2023 its plans to build its first domestic OSAT...
There is a bit of debate about the role that heterogeneous packaging plays in furthering Moore’s Law. Moore’s Law has historically focused on the number of transistors doubling per unit area. In discussions at IEDM, it appears that the definition is being modified to include the chip stacking that is...
Eleven customers pre-ordered 75 Dragonfly G3 systems with new EB40 modules for high-speed, all-surface wafer inspection New EB40 tool expands the Company’s process control market for advanced logic and memory wafers WILMINGTON, Mass.–(BUSINESS WIRE)–Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced its first shipment of...
Major Foundry Investments in the US Samsung, Intel, and TSMC are all making large foundry investments in the US. First reported in May, Samsung Electronics is reportedly now close to finalizing the site selection for its new $17B foundry in the United States. The investment would create a second foundry,...
Moore’s law is increasingly difficult to maintain and is driving the growth of innovative, high-density advanced packaging technologies in response to system scaling demands. These innovations are increasingly in the form of fan-out wafer level packaging (FOWLP) or multi-substrate / multi-device packages like interposers and system-in-package (SiP). New challenges come...
Moore’s law is increasingly difficult to maintain and is driving the growth of innovative high-density advanced packaging (HDAP) technologies in response to system scaling demands. These innovations are increasingly in the form of fan-out wafer level packaging (FOWLP) or multi-substrate / multi-device packages like interposers and system-in-package (SiP). New challenges...
I’ve long held the belief that when it comes to reading scholarly works, very few people read the entire paper. At best, they read the title, introduction, and conclusion. At most, they skim the rest. Last week at 3D ASIP 2017, my suspicions were confirmed, when it was revealed by...
The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9% CAGR 2016-2022, reaching about US$135 billion by 2022, with DRAM and NAND constituting almost 95% market share. Moreover, a supply-demand mismatch is pushing memory device asking selling price (ASP), resulting...
2016 was the year of strong consolidations in the semiconductor industry. Yole Développement (Yole) highlights many mergers and acquisitions with several billions of dollars transactions.“And 2017 seems to be following the same path”, wrote Jérôme Azemar, Technology & Market Analyst, Advanced Packaging at Yole in an article posted on i-micronews.com....
Emerging “More than Moore” and photonic applications benefit tremendously from the close integration of compound semiconductor materials. Recently, many of the improvements in device performance achieved within the semiconductor industry are a result of innovation and material research rather than traditional downscaling of design features. One of the major new...
