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MUNICH, May 30th, 2023 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, has developed first-of-its-kind equipment for the metrology and analysis of warped wafers. Thanks to its advanced optical scanning methodology, Wave3000 can accurately measure wafer deformities in specific handling positions. It...
Economics are forcing semiconductor manufacturers away from traditional 3D through silicon via (TSV) packaging integration. The future of advanced packaging continues to evolve towards chiplets and innovative new ways to combine specialized microelectronics components. This allows manufacturers to streamline the production for individual “subassemblies” that can then be configured later...
I cannot say I enjoyed this year’s COVID 19 version of ECTC 2020, but I guess it was better than nothing. I will leave the discussion of what I would like to see improved in the software package for the organizers. Let’s first take a look at three key papers...
The 2020 3D InCites Awards program has been a bit of a nail biter for us all, as we waited for the judges’ votes to see how they aligned with the online votes. Remember: the online votes serve as one judge. So, it was possible to win the online vote...
Advanced packaging has entered its most successful era boosted by a need for better integration, the end of Moore’s law and, beyond that, the megatrends, transportation, 5G, consumer, memory & computing, artificial intelligence (AI) and high-performance computing (HPC). The market today is dominated by large integrated device manufacturers (IDMs), such...
Fan-out panel level production is underway at Powertech Technology, Inc. (PTI) for MediaTek’s power management integrated circuit (PMIC) for smartphone applications. The Samsung Galaxy watch uses the fan-out panel level process (FOPLP) developed by Samsung Electro-Mechanics (SEMCO) to package the application processor and PMIC. Future applications under consideration for panel production...
In 2015, more than US$1 billion was invested in China’s advanced packaging ecosystem, announces Yole Développement (Yole) in its report Status and Prospects for the Advanced Packaging Industry. And right now, more than 100 companies are involved in assembly and packaging activities in China. Almost all key global integrated device manufacturers...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced new capabilities on the EVG ComBond® automated high-vacuum wafer bonding platform specifically designed to support high-volume manufacturing (HVM) of advanced MEMS devices. These capabilities include a new vacuum bond...
Fan-out wafer level packaging’s star is clearly on the rise as a low-cost solution for consumer mobile products, and the semiconductor industry trade news has been buzzing with unsubstantiated claims that Qualcomm is ditching through silicon vias (TSVs) for monolithic 3D ICs (M3D) in its next generation of cell phones....
I have to admit, for some time I’ve been fairly skeptical about glass interposer technology as a viable alternative to silicon interposers. It’s not that I doubted the expertise of research scientists like Rao Tummala and Venky Sundaram at Georgia Tech’s 3D Packaging Research Center (PRC), who have been evangelizing about...
