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MUNICH, May 30th, 2023 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, has developed first-of-its-kind equipment for the metrology and analysis of warped wafers. Thanks to its advanced optical scanning methodology, Wave3000 can accurately measure wafer deformities in specific handling positions. It...
Economics are forcing semiconductor manufacturers away from traditional 3D through silicon via (TSV) packaging integration. The future of advanced packaging continues to evolve towards chiplets and innovative new ways to combine specialized microelectronics components. This allows manufacturers to streamline the production for individual “subassemblies” that can then be configured later...
As semiconductor device manufacturers further shrink the size and increase the reliability of packaging devices, plasma treatment is increasingly used for advanced applications during wafer level packaging. For advanced applications Trymax has released a new low temperature plasma treatment for packaging solutions. This new DCP™, Direct Coupling Plasma Technology, for...
Several decades ago, Asia began its quest to be a reliable and cost-effective IC packaging, assembly, and test partner for low complexity ICs. Since then, Asia has proven itself as the world’s dominant wafer manufacturer and developer of process technologies, down to smallest feature sizes. On August 4, 2020, I...
I cannot say I enjoyed this year’s COVID 19 version of ECTC 2020, but I guess it was better than nothing. I will leave the discussion of what I would like to see improved in the software package for the organizers. Let’s first take a look at three key papers...
The 2020 3D InCites Awards program has been a bit of a nail biter for us all, as we waited for the judges’ votes to see how they aligned with the online votes. Remember: the online votes serve as one judge. So, it was possible to win the online vote...
Advanced packaging has entered its most successful era boosted by a need for better integration, the end of Moore’s law and, beyond that, the megatrends, transportation, 5G, consumer, memory & computing, artificial intelligence (AI) and high-performance computing (HPC). The market today is dominated by large integrated device manufacturers (IDMs), such...
In 2015, more than US$1 billion was invested in China’s advanced packaging ecosystem, announces Yole Développement (Yole) in its report Status and Prospects for the Advanced Packaging Industry. And right now, more than 100 companies are involved in assembly and packaging activities in China. Almost all key global integrated device manufacturers...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced new capabilities on the EVG ComBond® automated high-vacuum wafer bonding platform specifically designed to support high-volume manufacturing (HVM) of advanced MEMS devices. These capabilities include a new vacuum bond...
In 2013, SPTS equipment sales into the advanced packaging market grew by 75%. Some of this was due to a resurgence in 3D wafer level packaging (3D WLP); the first-generation 3D that started with CMOS image sensors in the middle of the last decade. This year’s growth was predominantly due...
