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TSMC/Amkor agreement Will Put U.S. Advanced Packaging on The Map TSMC has signed a memorandum of understanding (MoU) with Amkor Technology. Under the agreement, Amkor will provide TSMC with turnkey advanced packaging and test services from its planned assembly and test company plant in Peoria, Arizona. Both TSMC and Amkor...
ACM Research, Inc., a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced it has received purchase orders for four wafer-level packaging tools, including two from a U.S.-based customer and two from a U.S.-based research and development (R&D) center. “We are pleased to receive these...
As semiconductor device manufacturers further shrink the size and increase the reliability of packaging devices, plasma treatment is increasingly used for advanced applications during wafer level packaging. For advanced applications Trymax has released a new low temperature plasma treatment for packaging solutions. This new DCP™, Direct Coupling Plasma Technology, for...
Several decades ago, Asia began its quest to be a reliable and cost-effective IC packaging, assembly, and test partner for low complexity ICs. Since then, Asia has proven itself as the world’s dominant wafer manufacturer and developer of process technologies, down to smallest feature sizes. On August 4, 2020, I...
In a recent MEPTEC / iMAPS webinar, Jan Vardaman, President, and Founder of TechSearch International presented growth drivers for advanced packaging and related technology innovations to meet market demand. Unlike in previous years, when she had to spend part of her MEPTEC presentation explaining what the term “advanced packaging” means and...
For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...
Back in 2013, when 3D through silicon via (3D TSV) technology was a hot topic, SEMI Europe created the European 3D TSV Summit in response. Six years later, in response to the changing 3D integration landscape, the event was revised, extended and consequently renamed the 3D & Systems Summit. I...
The trade show floors at the combined SEMICON Europa and Productronica events can be daunting. In past years, we’ve focused our visits on the SEMICON Europa exhibitor floor, but as the lines fade between front-end processes, advanced packaging, and board assembly, getting the whole story called for visits to the...
In 2013, SPTS equipment sales into the advanced packaging market grew by 75%. Some of this was due to a resurgence in 3D wafer level packaging (3D WLP); the first-generation 3D that started with CMOS image sensors in the middle of the last decade. This year’s growth was predominantly due...
2024 3D InCites Technology Enablement Awards Finalists For the 2024 3D InCites Awards, we decided to change things up a bit and do away with our standard categories from previous years. Instead, we will be awarding five Technology Enablement Awards to companies who have identified a challenge in the adoption...
