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ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications in Compound Semiconductor Manufacturing 

Aug 30, 2021

Automated system for flat or notched wafers; multiple orders to ship during third quarter of 2021 Fremont, Calif. – August 25, 2021 – ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced the launch of ACM’s Ultra ECP GIII plating tool to...

TechSearch Presentation Highlights Key Developments in Advanced Packaging

Jul 28, 2020

In a recent MEPTEC / iMAPS webinar, Jan Vardaman, President, and Founder of TechSearch International presented growth drivers for advanced packaging and related technology innovations to meet market demand. Unlike in previous years, when she had to spend part of her MEPTEC presentation explaining what the term “advanced packaging” means and...

How AiP Technology Helps Enable 5G and More

Jun 04, 2020

For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...

SEMICON Europa and Productronica 2019 Exhibitor Showcase

Nov 25, 2019

The trade show floors at the combined SEMICON Europa and Productronica events can be daunting. In past years, we’ve focused our visits on the SEMICON Europa exhibitor floor, but as the lines fade between front-end processes, advanced packaging, and board assembly, getting the whole story called for visits to the...

Rudolph Technologies Unveils New Inspection Suite for Front- and Back-end Semiconductor Manufacturing

Sep 07, 2016

Rudolph continues to drive the technological innovation of its inspection and metrology products to deliver solutions that address the demanding needs across front- and back-end processes Wilmington, Mass. (September 6, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC) today launched two new inspection and metrology solutions for advanced semiconductor manufacturing: the Firefly™ System...

Spotlight on FOWLP, Monolithic 3D IC and 3D TSVs

May 13, 2015

Fan-out wafer level packaging’s star is clearly on the rise as a low-cost solution for consumer mobile products, and the semiconductor industry trade news has been buzzing with unsubstantiated claims that Qualcomm is ditching through silicon vias (TSVs) for monolithic 3D ICs (M3D) in its next generation of cell phones....

SPTS and Fraunhofer IZM Work to Advance Wafer Level Packaging

Jan 16, 2015

Fraunhofer IZM Selects SPTS’ DRIE and Low Temperature CVD to Develop Next Generation Manufacturing Techniques ORBOTECH LTD. announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, is collaborating with Fraunhofer IZM, an international institute specializing in...

Glass Interposers Take the Stage at ECTC 2014

Jun 03, 2014

I have to admit, for some time I’ve been fairly skeptical about glass interposer technology as a viable alternative to silicon interposers. It’s not that I doubted the expertise of research scientists like Rao Tummala and Venky Sundaram at Georgia Tech’s 3D Packaging Research Center (PRC), who have been evangelizing about...

2023 3D InCites Awards Winner Circle

Mar 14, 2023

2023 3D InCites Awards Winner Circle The 2023 3D InCites Awards program recognized industry-wide contributions in the development of heterogeneous integration and 3D technologies.  In 2021, we added two awards to recognize companies that demonstrate best practices in sustainable manufacturing efforts, as well as diversity equity and inclusion (DEI). Below are the...