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New Tools Drive Innovation in Semiconductor Packaging with AI Solutions that Improve Yield and Quality MILPITAS, Calif., Sept. 21, 2020 /PRNewswire/ — Today, KLA Corporation (NASDAQ: KLAC) announced the launch of the Kronos™ 1190 wafer-level packaging inspection system, the ICOS™ F160XP die sorting and inspection system and the next generation of the...
As IFTLE has been predicting for many years, the baton is once again being passed. In the early days of advanced microelectronics, packaging breakthroughs were developed by integrated device manufacturers like IBM, DEC, NEC, Fujitsu, etc. In the early 2000s, this baton was passed to the OSATS like Amkor, ASE,...
“Automotive applications are the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole). The market is showing significant market drivers that are daily supporting the growth: electrification, connectivity, autonomy, and comfort are the keywords of today’s automotive industry. Under this dynamic context, the...
Advanced packaging is a key enabling technology that not only serves as packaging support but also offers more value and cost reduction to the final products. The advanced packaging industry with its 7% CAGR between 2016 and 2022 (in revenues)¹ is undoubtedly a dynamic sector where innovations play a key...
Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth in revenue of +7% between 2016 and 2022. “Advanced packaging is showing a total revenue CAGR higher than the total packaging industry (3-4%), semiconductor industry (4-5%) and generally the global electronics industry (3-4%)”,...
At ECTC 2016, which took place at the Cosmopolitan Las Vegas, Las Vegas, May 31-June 1, 2016, the special session entitled, Memory Technology Advances and Prospects for Packaging may have been one of the “most important starts to ECTC ever.” At least that was TechSearch’s, Jan Vardaman’s impression, and I can’t disagree,...
TEMPE, Ariz., May 2, 2016 — Amkor Technology, Inc. (NASDAQ: AMKR), a leading outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with Cadence Design Systems, Inc. (NASDAQ: CDNS) to streamline semiconductor package verification with the joint development of a package assembly design kit (PADK)...
Fraunhofer IZM Selects SPTS’ DRIE and Low Temperature CVD to Develop Next Generation Manufacturing Techniques ORBOTECH LTD. announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, is collaborating with Fraunhofer IZM, an international institute specializing in...
EV Group (EVG), supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that it has developed a new micro-lens molding process that can enable volume production of very-high-resolution (up to eight megapixels and higher) wafer-level optics for use in smart phones, pico projectors and...
2023 3D InCites Awards Winner Circle The 2023 3D InCites Awards program recognized industry-wide contributions in the development of heterogeneous integration and 3D technologies. In 2021, we added two awards to recognize companies that demonstrate best practices in sustainable manufacturing efforts, as well as diversity equity and inclusion (DEI). Below are the...
