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ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications in Compound Semiconductor Manufacturing 

Aug 30, 2021

Automated system for flat or notched wafers; multiple orders to ship during third quarter of 2021 Fremont, Calif. – August 25, 2021 – ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced the launch of ACM’s Ultra ECP GIII plating tool to...

KLA Announces Enhanced Portfolio of Systems for Advanced Packaging

Sep 22, 2020

New Tools Drive Innovation in Semiconductor Packaging with AI Solutions that Improve Yield and Quality MILPITAS, Calif., Sept. 21, 2020 /PRNewswire/ — Today, KLA Corporation (NASDAQ: KLAC) announced the launch of the Kronos™ 1190 wafer-level packaging inspection system, the ICOS™ F160XP die sorting and inspection system and the next generation of the...

3D & Systems Summit Explores an Expanding Application Space

Mar 10, 2020

Back in 2013, when 3D through silicon via (3D TSV) technology was a hot topic, SEMI Europe created the European 3D TSV Summit in response. Six years later, in response to the changing 3D integration landscape, the event was revised, extended and consequently renamed the 3D & Systems Summit. I...

IFTLE 417: Passing the Advanced Packaging Baton to TSMC and its 3D-MiM

Jun 20, 2019

As IFTLE has been predicting for many years, the baton is once again being passed. In the early days of advanced microelectronics, packaging breakthroughs were developed by integrated device manufacturers like IBM, DEC, NEC, Fujitsu, etc. In the early 2000s, this baton was passed to the OSATS like Amkor, ASE,...

Fan-out is Hot, 3D Is Back, and 5G is Needed: The Inside Scoop from ECTC 2018

Jun 09, 2018

There’s fact, and there’s perception. The messages people carry away from conferences are not only influenced by what they hear from the speakers, but also from the conversations they have with their colleagues. This post contains a little of both. At IMAPS Device Packaging Conference in March, Yole Developpement analyst,...

Gartner: New Normal is Slow Growth, Plentiful FOWLP

Sep 29, 2016

What is the “new normal” for semiconductors? Jim Walker, Research VP, Semiconductor Manufacturing, Gartner, closed out Q3 2016 with his informative talk at the IMAPS | MEPTEC | SEMI Northern California Chapter luncheon meeting on September 28, 2016, at SEMI HQ in San Jose, California, addressing the topic of the...

ECTC 2016: Memory Technology Advances and Prospects for Packaging

Jun 04, 2016

At ECTC 2016, which took place at the Cosmopolitan Las Vegas, Las Vegas, May 31-June 1, 2016, the special session entitled, Memory Technology Advances and Prospects for Packaging may have been one of the “most important starts to ECTC ever.” At least that was TechSearch’s, Jan Vardaman’s impression, and I can’t disagree,...

SPTS and Fraunhofer IZM Work to Advance Wafer Level Packaging

Jan 16, 2015

Fraunhofer IZM Selects SPTS’ DRIE and Low Temperature CVD to Develop Next Generation Manufacturing Techniques ORBOTECH LTD. announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, is collaborating with Fraunhofer IZM, an international institute specializing in...

2024 3D InCites Technology Enablement Awards Finalists

Jan 09, 2024

2024 3D InCites Technology Enablement Awards Finalists For the 2024 3D InCites Awards, we decided to change things up a bit and do away with our standard categories from previous years. Instead, we will be awarding five Technology Enablement Awards to companies who have identified a challenge in the adoption...

2023 3D InCites Awards Winner Circle

Mar 14, 2023

2023 3D InCites Awards Winner Circle The 2023 3D InCites Awards program recognized industry-wide contributions in the development of heterogeneous integration and 3D technologies.  In 2021, we added two awards to recognize companies that demonstrate best practices in sustainable manufacturing efforts, as well as diversity equity and inclusion (DEI). Below are the...