Matches for your search: "fan-out wafer level packaging "
Back in 2013, when 3D through silicon via (3D TSV) technology was a hot topic, SEMI Europe created the European 3D TSV Summit in response. Six years later, in response to the changing 3D integration landscape, the event was revised, extended and consequently renamed the 3D & Systems Summit. I...
As IFTLE has been predicting for many years, the baton is once again being passed. In the early days of advanced microelectronics, packaging breakthroughs were developed by integrated device manufacturers like IBM, DEC, NEC, Fujitsu, etc. In the early 2000s, this baton was passed to the OSATS like Amkor, ASE,...
“Automotive applications are the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole). The market is showing significant market drivers that are daily supporting the growth: electrification, connectivity, autonomy, and comfort are the keywords of today’s automotive industry. Under this dynamic context, the...
Fan-out panel level production is underway at Powertech Technology, Inc. (PTI) for MediaTek’s power management integrated circuit (PMIC) for smartphone applications. The Samsung Galaxy watch uses the fan-out panel level process (FOPLP) developed by Samsung Electro-Mechanics (SEMCO) to package the application processor and PMIC. Future applications under consideration for panel production...
Today’s electronic products present new challenges to product development teams. As a result, there is a constant push to improve product quality and design efficiency through the use of new design technologies. For example, system-scaling demands change as Moore’s law becomes increasingly difficult to maintain, thus driving growth of innovative...
Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth in revenue of +7% between 2016 and 2022. “Advanced packaging is showing a total revenue CAGR higher than the total packaging industry (3-4%), semiconductor industry (4-5%) and generally the global electronics industry (3-4%)”,...
The WeKoPa Resort near Phoenix was the venue for the latest IC packaging focused conference, IMAPS DPC 2017, which took place in early March. The exhibition floor and all the sessions I joined were well attended and covered a broad range of topics, including design tools and methodology demonstrations from...
At ECTC 2016, which took place at the Cosmopolitan Las Vegas, Las Vegas, May 31-June 1, 2016, the special session entitled, Memory Technology Advances and Prospects for Packaging may have been one of the “most important starts to ECTC ever.” At least that was TechSearch’s, Jan Vardaman’s impression, and I can’t disagree,...
In the world of 3D ICs, where features are becoming finer and submicron accuracy and precision is more important than ever to maintain intra-wafer uniformity throughout the wafer or die stacking process flow, process control by means of metrology and inspection is more important than ever. The industry offers a...
2024 3D InCites Technology Enablement Awards Finalists For the 2024 3D InCites Awards, we decided to change things up a bit and do away with our standard categories from previous years. Instead, we will be awarding five Technology Enablement Awards to companies who have identified a challenge in the adoption...
