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Shield USA Project will strengthen U.S. semiconductor packaging capabilities The National Institute of Standards and Technology — part of the U.S. Department of Commerce — announced today that it plans to award as much as $100 million to Arizona State University and Deca Technologies for the SHIELD USA initiative. SHEILD...
With AMD’s announcement of its Elevated Fanout Bridge (EFB) GPU package, the embedded bridge for fan-out (FO) on substrate is in the spotlight. With assembly of EFB at an OSAT, the development highlights the ability of OSATs to have a strong play in the high-performance packaging market. TechSearch International discusses...
Will TSMC build advanced packaging facilities offshore? In IFTLE 490, we reported that TSMC is considering building an advanced IC packaging plant in the US. Now, from the Asia Times we learn in an article by Scott Foster, an analyst with Lightstream Research – Tokyo that in February, it was...
“Advanced packaging solutions will double their market shares within the automotive industry in the coming 5 years, reaching US$550 million” announces Mario Ibrahim, Technology & Market Analyst at Yole Développement (Yole). Two automotive megatrends, autonomy and electrification are today pushing the development of multiple devices with dedicated packaging. Without doubts,...
According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in 2022, showing a 16.7% CAGR[1] over this period. The MEMS packaging market’s value is growing faster than the MEMS device market’s value: respectively, a 16.7% CAGR for packaging versus 14.1%...
Today’s electronic products present new challenges to product development teams. As a result, there is a constant push to improve product quality and design efficiency through the use of new design technologies. For example, system-scaling demands change as Moore’s law becomes increasingly difficult to maintain, thus driving growth of innovative...
The semiconductor industry is acting quite young for its age. And that’s just not me saying it; over and over again during SEMICON West 2017 I heard some variation of the phrase “We’re just getting started.” What was it that accounted for the upbeat and buoyant mood at SEMICON West...
Françoise promised in her recent blog that my ECTC blog would follow shortly. Finally, after attending DAC in Austin as well as the iMAPS’ SiP Conference in California’s Wine Country and shortly before attending Semicon West in San Francisco, I found some time to report what I saw and learned...
In the world of 3D ICs, where features are becoming finer and submicron accuracy and precision is more important than ever to maintain intra-wafer uniformity throughout the wafer or die stacking process flow, process control by means of metrology and inspection is more important than ever. The industry offers a...
STATS ChipPAC Ltd., semiconductor test and advanced packaging service provider, today held the groundbreaking ceremony for a new factory in Singapore. The new 197,000 square foot building will be located next to the Company’s current factory in Yishun, Singapore and will enable STATS ChipPAC to expand its manufacturing capabilities for...
