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The International Microelectronics Assembly and Packaging Society (IMAPS), the largest organization dedicated to the advancement and growth of microelectronics and electronics packaging, today formally introduced IMAPS Academy, an online training resource to support the industry’s rapidly growing need for workforce development. IMAPS has a strong track record of delivering in-person...
Joint Development Program will offer highly configurable, ultra-precision end-to-end hybrid bonding solutions to suit various applications, with optimal line balancing and process requirements ASM PACIFIC TECHNOLOGY (ASM) and EV GROUP (EVG) announced the signing of a joint development agreement (JDA) to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications. Die-to-wafer hybrid bonding...
“Advanced packaging solutions will double their market shares within the automotive industry in the coming 5 years, reaching US$550 million” announces Mario Ibrahim, Technology & Market Analyst at Yole Développement (Yole). Two automotive megatrends, autonomy and electrification are today pushing the development of multiple devices with dedicated packaging. Without doubts,...
Yole Développement (Yole) power electronics team’s presents this year an optimistic analysis of the power electronics industry. The power device market is showing a comfortable 13.9% growth between 2018, compared to 2017. The market research & strategy consulting company points out a second consecutive high-growth year in this industry, after...
There’s fact, and there’s perception. The messages people carry away from conferences are not only influenced by what they hear from the speakers, but also from the conversations they have with their colleagues. This post contains a little of both. At IMAPS Device Packaging Conference in March, Yole Developpement analyst,...
According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in 2022, showing a 16.7% CAGR[1] over this period. The MEMS packaging market’s value is growing faster than the MEMS device market’s value: respectively, a 16.7% CAGR for packaging versus 14.1%...
Advanced packaging is a key enabling technology that not only serves as packaging support but also offers more value and cost reduction to the final products. The advanced packaging industry with its 7% CAGR between 2016 and 2022 (in revenues)¹ is undoubtedly a dynamic sector where innovations play a key...
What is the “new normal” for semiconductors? Jim Walker, Research VP, Semiconductor Manufacturing, Gartner, closed out Q3 2016 with his informative talk at the IMAPS | MEPTEC | SEMI Northern California Chapter luncheon meeting on September 28, 2016, at SEMI HQ in San Jose, California, addressing the topic of the...
TEMPE, Ariz., May 2, 2016 — Amkor Technology, Inc. (NASDAQ: AMKR), a leading outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with Cadence Design Systems, Inc. (NASDAQ: CDNS) to streamline semiconductor package verification with the joint development of a package assembly design kit (PADK)...
STATS ChipPAC Ltd., semiconductor test and advanced packaging service provider, today held the groundbreaking ceremony for a new factory in Singapore. The new 197,000 square foot building will be located next to the Company’s current factory in Yishun, Singapore and will enable STATS ChipPAC to expand its manufacturing capabilities for...
