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The International Microelectronics Assembly and Packaging Society (IMAPS), the largest organization dedicated to the advancement and growth of microelectronics and electronics packaging, today formally introduced IMAPS Academy, an online training resource to support the industry’s rapidly growing need for workforce development. IMAPS has a strong track record of delivering in-person...
With AMD’s announcement of its Elevated Fanout Bridge (EFB) GPU package, the embedded bridge for fan-out (FO) on substrate is in the spotlight. With assembly of EFB at an OSAT, the development highlights the ability of OSATs to have a strong play in the high-performance packaging market. TechSearch International discusses...
Will TSMC build advanced packaging facilities offshore? In IFTLE 490, we reported that TSMC is considering building an advanced IC packaging plant in the US. Now, from the Asia Times we learn in an article by Scott Foster, an analyst with Lightstream Research – Tokyo that in February, it was...
Joint Development Program will offer highly configurable, ultra-precision end-to-end hybrid bonding solutions to suit various applications, with optimal line balancing and process requirements ASM PACIFIC TECHNOLOGY (ASM) and EV GROUP (EVG) announced the signing of a joint development agreement (JDA) to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications. Die-to-wafer hybrid bonding...
Yole Développement (Yole) power electronics team’s presents this year an optimistic analysis of the power electronics industry. The power device market is showing a comfortable 13.9% growth between 2018, compared to 2017. The market research & strategy consulting company points out a second consecutive high-growth year in this industry, after...
According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in 2022, showing a 16.7% CAGR[1] over this period. The MEMS packaging market’s value is growing faster than the MEMS device market’s value: respectively, a 16.7% CAGR for packaging versus 14.1%...
The semiconductor industry is acting quite young for its age. And that’s just not me saying it; over and over again during SEMICON West 2017 I heard some variation of the phrase “We’re just getting started.” What was it that accounted for the upbeat and buoyant mood at SEMICON West...
Françoise promised in her recent blog that my ECTC blog would follow shortly. Finally, after attending DAC in Austin as well as the iMAPS’ SiP Conference in California’s Wine Country and shortly before attending Semicon West in San Francisco, I found some time to report what I saw and learned...
Last year, I did an analysis that included the topic of wafer-to-wafer bonding. Specifically, it was a comparison of the three variations available when stacking wafers and/or die—wafer-to-wafer (W2W), die-to-wafer (D2W), and die-to-die (D2D). The goal of that project was to build cost models for W2W and D2W (with the...
STATS ChipPAC Ltd., semiconductor test and advanced packaging service provider, today held the groundbreaking ceremony for a new factory in Singapore. The new 197,000 square foot building will be located next to the Company’s current factory in Yishun, Singapore and will enable STATS ChipPAC to expand its manufacturing capabilities for...
