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More than a few years ago, somewhere around 28nm, my working group was discussing the potential demise of “Moore’s Law”. The industry and international technology roadmap committee were struggling with hi-k metal gates, strain, FinFETs, and of course how lithography could keep shrinking. The designing and manufacturing of a system...
The annual IEEE Electronics Packaging Technology Conference (EPTC 2020 – Asia’s equivalent to the ECTC) took place virtually in December, instead of in Singapore as originally planned. With most of the world’s packaging being done in Asia, it is always a great source of interesting advanced packaging presentations. Let’s take...
With each passing year, emerging growth application areas such as Automotive, Cloud Computing, Industrial Automation, and Telecom (5G) Infrastructure are garnering more attention. Although the application segments are different, there is a commonality in how voltage conversion and power distribution are achieved at the system level. System demands are becoming...
In a recent IMAPS webinar, John Park (Figure 1), product management director of Cadence Design Systems, gave a tutorial entitled “This Is Not Your Father’s Advanced Semiconductor Packaging…an EDA Perspective”. Herb Reiter reviewed it here. While a lot of the technical detail that he shared was probably beyond the older...
The semiconductor industry is at a turning point. The slowdown in CMOS scaling, coupled with escalating costs, has prompted the industry to rely on integrated circuit (IC) packaging to extend the benefits of the More-than-Moore era. Thus, the advanced packaging industry has entered its most successful period, boosted by widespread...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the new SmartView® NT3 aligner, which is available on the company’s industry benchmark GEMINI® FB XT integrated fusion bonding system for high-volume manufacturing (HVM) applications. Developed specifically for fusion...
Sitting in the bus on the way back from Grenoble to Airport Lyon, I am reflecting the last two days during which we honored Gilles Poupon, the Advanced Packaging “Pope” of CEA Leti. Upon his retirement at the end of November 2017, somehow an era ends. I have known Gilles...
Fan-out wafer-level packaging (FOWLP) is an emerging type of high-density advanced packaging (HDAP) technology in the semiconductor industry that is rapidly gaining popularity in the market. But what exactly is FOWLP? Why do we need it? How do we take advantage of it? What limitations still need to be overcome?...
Consumer electronics designers continue to demand thinner and lighter packages while devices increase in functional complexity. The Fan-Out Wafer Level Package (FOWLP) platform has been gaining momentum with the advantages it offers in electrical performance, assembly process efficiency and low geometric profile. Different approaches of Package-on-Package (PoP) stacking in FOWLP...
You might recall that a few year’s back (October 2013, to be precise), 3D InCites’ regular blogger, Paul Werbaneth, had the opportunity to interview Dongkai Shangguan, then CEO of the National Center for Advanced Packaging (NCAP) in Wuxi, China, which he helped found along with nine investors. They talked about...
