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Nordson Electronics Solutions to Feature High-throughput Fluid Dispensing Technologies for Wafer-level and Panel-level Packaging at SEMICON Taiwan 2024

Aug 28, 2024

Visit booth #L0516 to discuss the latest developments in fluid dispensing for advanced semiconductor packaging. Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516. On display will be the ASYMTEK...

IFTLE 596: Advanced Packaging Reshaping the Chip Ecosystem

Jun 17, 2024

The Boston Consultant Group (BCG) recently took a look at the impact that advanced packaging is having on the microelectronics chip ecosystem.  Let’s take a look at some of the points that they make. Advanced packaging is replacing simple “scaling”, which had been the traditional way to achieve advancements in...

The Alphabet Soup of 3D Packaging

Jun 07, 2023

More than a few years ago, somewhere around 28nm, my working group was discussing the potential demise of “Moore’s Law”. The industry and international technology roadmap committee were struggling with hi-k metal gates, strain, FinFETs, and of course how lithography could keep shrinking. The designing and manufacturing of a system...

IFTLE 551: SK Hynix Advanced Packaging; Integra Expansion in Kansas

Mar 15, 2023

SK Hynix Advanced Packaging Ki-ill Moon, head of Packaging Technology Development at SK Hynix recently wrote an article for EE Times entitled “ The Value of Semiconductor Packaging Technology in the Era of Heterogeneous Integration” that is certainly worth taking a closer look at. The theme of the article is...

IFTLE 490: TSMC considers Packaging Facility in the US; EMIB Technology Advances

Jun 30, 2021

TSMC considers Packaging Facility in the US The Taipei Times is reporting (via Nikkei Japan) that TSMC is considering building an advanced IC packaging facility in the US. The potential US packaging plant would be equipped with the latest 3D stacking technologies. IC packaging is highly localized in Asia and...

The IWLPC Fan-out PLP Smack Down

Nov 13, 2019

At IWLPC 2019, the fan-out panel-level packaging (PLP) debate continued in another of Jan Vardaman’s famous lively panel discussions, which was co-moderated by PLP technology expert, Tanja Braun, Fraunhofer IZM. Panelists were John Hunt, ASE; Joseph Dang, AT&S; Keith Best, Rudolph Technologies; Tim Olson, Deca Technologies. Fan-out PLP (FO PLP)...

2018 Outlook for Advanced Packaging Materials

Jan 12, 2018

Advanced packaging is moving mainstream as manufacturers continue to seek ways to improve device performance beyond traditional scaling. The semiconductor industry is also witnessing increasing investments in packaging, in terms of capabilities, capacity, and infrastructure from the assembly and packaging houses. All this attention on packaging is primarily driven by...

Executive Viewpoint: The New Advanced Packaging Landscape

Jun 30, 2016

You might recall that a few year’s back (October 2013, to be precise), 3D InCites’ regular blogger, Paul Werbaneth, had the opportunity to interview Dongkai Shangguan, then CEO of the National Center for Advanced Packaging (NCAP) in Wuxi, China, which he helped found along with nine investors. They talked about...

The Advanced Packaging Industry Reaches its Zenith

Apr 13, 2016

To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have been developed by industrial companies. Leaders in the advanced packaging industry have identified new solutions enabling more and more functionalities to be integrated along with many devices in the same...

Himax Technologies Selects EV Group to Expand Production Capacity for Wafer-Level Optics

Mar 27, 2012

Repeat Order for IQ Aligner Further Solidifies EVG’s Position as Leading Microlens Molding Solutions Provider for Wafer-level Camera Applications  St. Florian, AUSTRIA, March 27, 2012 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Himax Technologies,...